Light-emitting device package and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorHyung-kun Kim
Life of this patent
Estimating the term…
Abstract
A light-emitting device package uses a metal layer as a reflective region and includes a light-emitting device chip and an electrode pad that are disposed on an insulating layer. In addition, the electrode pad and an electrode pattern of a printed circuit board are connected to each other by an electrode pattern formed of conductive ink. A method of manufacturing a light-emitting device package includes forming an insulating layer on a metal layer, and bonding a light-emitting device chip and an electrode pad on the insulating layer. The electrode pad and a printed circuit board are connected to each other by conductive ink.
Claims9
A method of manufacturing a light-emitting device package, the method comprising:
- preparing a metal layer;
- forming an insulating layer on the metal layer;
- forming a first electrode pattern on an edge portion of the insulating layer;
- bonding at least one light-emitting device chip on the insulating layer;
- forming at least one electrode pad around the at least one light-emitting device chip such that the at least one electrode pad is electrically separated from the at least one light-emitting device chip and the first electrode pattern;
- and
- forming a second electrode pattern for connecting the first electrode pattern and the at least one electrode pad to each other on the insulating layer.
Dependencies are inferred from the claim text.