Chip on film (COF) package having test line for testing electrical function of chip and method for manufacturing same
AssigneeSamsung Electronics Co., Ltd.
InventorsHyoung-ho Kim, Ye-jung Jung
Life of this patent
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Abstract
A chip on film (COF) package and a method for manufacturing same are provided. The COF package comprises a base film, a semiconductor chip mounted on the base film, a signal-inputting portion mounted on the base film, a first passive element mounted on the base film and comprising first and second terminals and a first signal line formed on the base film and connecting the first passive element to the semiconductor chip, wherein the first signal line comprises a connection pad connected to the first terminal of the first passive element and a first test line connected to the signal-inputting portion.
Claims8
A chip on film (COF) package comprising:
- a base film;
- a semiconductor chip mounted on the base film;
- a signal-inputting portion mounted on the base film;
- a first passive element mounted on the base film and comprising first and second terminals;
- and
- a first signal line formed on the base film and connecting the first passive element to the semiconductor chip,
- wherein the first signal line comprises a connection pad connected to the first terminal of the first passive element and a first test line connected to the signal-inputting portion and the first terminal, wherein the first test line protrudes from the connection pad towards a first pad gap positioned between the first terminal and the second terminal of the first passive element, and the first test line passes through the first pad gap.
Dependencies are inferred from the claim text.