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US 8,709,556 B2Granted
Heat transfer label for decorating a metal container
AssigneeMCC-Norwood, LLC
InventorsSaifuddin M. Ansari, Ignatius S. Yee, Douglas L. Barnhardt, Robert J. Wojewoda
Life of this patent
Estimating the term…
Abstract
A heat transfer label assembly includes a heat transfer label including ink and adhesive, and a releasable support joined to the heat transfer label. The adhesive may include at least one of a polyketone resin and a polyamide resin. The heat transfer label may be used to decorate a metal article.
Claims38
A heat transfer label assembly, comprising:
- a heat transfer label portion including ink and an adhesive, wherein the adhesive comprises a polyketone resin and a polyamide resin, wherein the polyketone resin has a softening temperature of from about 90° C. to about 140° C.;
- and
- a releasable support portion joined to the heat transfer label portion.
A heat transfer label assembly, comprising:
- a heat transfer label portion including ink and an adhesive, wherein the adhesive comprises from about 5 to about 35 wt % polyketone resin and about 65 to about 95 wt % polyamide resin,
- wherein
- the polyketone resin has a softening temperature of from about 90° C. to about 140° C., and
- the polyamide resin has a softening temperature of from about 100° C. to about 150° C.;
- and
- a releasable support portion joined to the heat transfer label portion, wherein the releasable support portion comprises a release layer and a carrier, wherein the releasable support portion is configured so that the release layer is positioned between the heat transfer label portion and the carrier.
3 more elements
A heat transfer label assembly, comprising:
- a heat transfer label portion including ink and an adhesive, wherein the adhesive comprises from about 5 to about 35 wt % polyketone resin and about 65 to about 95 wt % polyamide resin,
- wherein
- the polyketone resin has a softening temperature of from about 90° C. to about 140° C., and
- the polyamide resin has a softening temperature of from about 160° C. to about 215° C.;
- and
- a releasable support portion joined to the heat transfer label portion, wherein the releasable support portion comprises a release layer and a carrier, wherein the releasable support portion is configured so that the release layer is positioned between the heat transfer label portion and the carrier.
3 more elements
A heat transfer label assembly, comprising:
- a heat transfer label portion including ink and an adhesive, wherein the comprises from about 5 to about 35 wt % polyketone resin and about 65 to about 95 wt % polyamide resin;
- and
- a releasable support portion joined to the heat transfer label portion,
- wherein the polyamide resin comprises a first polyamide resin and a second polyamide resin, wherein the first polyamide resin has a softening temperature of from about 100° C. to about 150° C., and the second polyamide resin has a softening temperature of from about 160° C. to about 215° C.
1 more element
A heat transfer label assembly, comprising:
- a heat transfer label portion including ink and an adhesive, wherein the adhesive comprises a polyketone resin and a polyamide resin, wherein the polyamide resin has a softening temperature of from about 100° C. to about 150° C.;
- and
- a releasable support portion joined to the heat transfer label portion.
A heat transfer label assembly, comprising:
- a heat transfer label portion including ink and an adhesive, wherein the adhesive comprises a polyketone resin and a polyamide resin, wherein the polyamide resin has a softening temperature of from about 160° C. to about 215° C.;
- and
- a releasable support portion joined to the heat transfer label portion.
A heat transfer label assembly, comprising:
- a heat transfer label portion including ink and an adhesive, wherein the adhesive comprises a polyketone resin, a first polyamide resin, and a second polyamide resin;
- and
- a releasable support portion joined to the heat transfer label portion.
Dependencies are inferred from the claim text.