Method for forming a film
AssigneeTokyo Electron Limited
InventorsKenji Matsumoto, Hidenori Miyoshi
Life of this patent
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Abstract
A method for forming a thin film on a surface of an object to be processed by using an organic metal raw material gas within a processing chamber configured to exhaust air includes: hydrophobizing a surface of the processing chamber by introducing a hydrophobic gas into the processing chamber without the object to be processed accommodated in the processing chamber; and forming the thin film by introducing the organic metal raw material gas into the processing chamber with the object to be processed accommodated in the processing chamber.
Claims3
A film forming method for forming a thin film on a surface of an object to be processed by using an organic metal raw material gas within a processing chamber configured to exhaust air, the method comprising:
- hydrophobizing a surface of the processing chamber by introducing a hydrophobic gas into the processing chamber without the object to be processed accommodated in the processing chamber;
- and
- forming the thin film by introducing the organic metal raw material gas into the processing chamber with the object to be processed accommodated in the processing chamber.
A film forming method for forming a thin film on a surface of an object to be processed by using an organic metal raw material gas within a processing chamber configured to exhaust air, the method comprising:
- forming a silicon layer on a surface of a member exposed to the atmosphere within the processing chamber in advance;
- hydrophobizing a surface of the silicon layer by introducing a hydrophobic gas into the processing chamber without the object to be processed accommodated in the processing chamber;
- and
- forming the thin film by introducing the organic metal raw material gas into the processing chamber with the object to be processed accommodated in the processing chamber.
Dependencies are inferred from the claim text.