Back to results
US 8,709,528 B2Granted
Wafer processing method and system using multi-zone chuck
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsNai-Han Cheng, Chi-Ming Yang, You-Hua Chou, Kuo-Sheng Chuang, Chin-Hsiang Lin
Life of this patent
Estimating the term…
Abstract
In a wafer processing method and a wafer processing system, a first property on a back side of a wafer is measured. The back side of the wafer is supported on a multi-zone chuck having a plurality of zones with controllable clamping forces. The wafer is secured to the multi-zone chuck by controlling the clamping forces in the corresponding zones in accordance with measured values of the first property in the zones.
Claims20
A wafer processing method, comprising:
- measuring a thickness of a first layer on a back side of a wafer,
- supporting the back side of the wafer on a multi-zone chuck having a plurality of zones with controllable clamping forces, and
- securing the wafer to the multi-zone chuck by controlling the clamping forces in the corresponding zones in accordance with measured values of the thickness of the first layer in said zones.
A wafer processing method, comprising:
- measuring warpage of a wafer,
- measuring a thickness of a dielectric layer on a back side of the wafer,
- supporting the back side of the wafer on a multi-zone electrostatic chuck having a plurality of zones with controllable clamping forces,
- securing the wafer to the multi-zone chuck by controlling the clamping forces in the corresponding zones in accordance with measured values of the warpage and the thickness of the dielectric layer in said zones.
1 more element
Dependencies are inferred from the claim text.