Flip-chip mounting resin composition and bump forming resin composition

A bump forming resin composition comprising:

• a resin,
• metal particles dispersed in the resin, and
• a convection additive which is contained in the resin and boils upon heating of the resin;
• wherein said convection additive is at least one material selected from the group consisting of butyl acetate and butyl carbitol,
• wherein, upon the heating of the resin, said metal particles melt and the boiling convection additive convects within the resin,
• wherein said resin composition is supplied onto a substrate which has a plurality of electrodes, and
• upon the heating of said resin composition the metal particles melt so that molten metal particles self-assemble onto each electrode of said substrate to form a metal bump on each electrode, and
• wherein the content of said metal particles contained in said resin ranges from 0.5 to 20% by volume and is defined by the following content percentage:
• Content percentage of metal particles (% by volume)=[(total surface area of electrodes)/(surface area of substrate×100±10)].

A flip-chip mounting or bump forming resin composition comprising:

• a resin,
• metal particles dispersed in the resin, and
• a convection additive which is contained in the resin and generates a gas upon heating of the resin;
• wherein said convection additive is at least one material selected from the group consisting of dawsonite, ammonium metaborate, barium metaborate, azodicarbonamide and sodium hydrogen carbonate,
• wherein, upon the heating of the resin, said metal particles melt and said gas generated from the convection additive convects within the resin,
• wherein said resin composition is:
• (a) supplied between substrates which are opposed to each other, each of said substrates having a plurality of electrodes, and
• upon the heating of said resin composition the metal particles melt so that molten metal particles self-assemble into a region between each electrode of one of said substrates and each electrode of the other of said substrates to form a connection therebetween, or
• (b) supplied onto a substrate which has a plurality of electrodes, and
• upon the heating of said resin composition the metal particles melt so that molten metal particles self-assemble onto each electrode of said substrate to form a metal bump on said each electrode, and
• wherein the content of said metal particles contained in said resin ranges from 0.5 to 20% by volume and is defined by the following content percentage:
• Content percentage of metal particles (% by volume)=[(total surface area of electrodes)/(surface area of substrate×100±10)].

A flip-chip mounting or bump forming resin composition comprising:

• at least one resin selected from the group consisting of polyamide-based resin and a polyimide-based resin, and
• metal particles dispersed in the resin,
• wherein the resin is capable of generating a gas upon a curing thereof when the resin is heated,
• wherein, upon the heating of the resin, said metal particles melt and said gas generated from the resin convects within the resin,
• wherein said resin composition is:
• (a) supplied between substrates which are opposed to each other, each of said substrates having a plurality of electrodes, and
• upon the heating of said resin composition the metal particles melt so that molten metal particles self-assemble into a region between each electrode of one of said substrates and each electrode of the other of said substrates to form a connection therebetween, or
• (b) supplied onto a substrate which has a plurality of electrodes, and
• upon the heating of said resin composition the metal particles melt so that molten metal particles self-assemble onto each electrode of said substrate to form a metal bump on said each electrode, and
• wherein the content of said metal particles contained in said resin ranges from 0.5 to 20% by volume and is defined by the following content percentage:
• Content percentage of metal particles (% by volume)=[(total surface area of electrodes)/(surface area of substrate×100±10)].