Method of making electronic component and heat conductive member and method of mounting heat conductive member for electronic component

A method of making a heat conductive member, comprising:

• placing a bonding material on a component;
• superposing a heat conductive member on a substrate so as to interpose a thermosetting adhesive in a solid state between the heat conductive member and the substrate so that the heat conductive member is opposed to a surface of the solid bonding material;
• applying heat to the thermosetting adhesive to liquefy the thermosetting adhesive so as to bring the heat conductive member in contact with surface of the solid bonding material;
• curing the thermosetting adhesive at a temperature lower than a melting point of the bonding material;
• supporting the heat conductive member with only the solid bonding material so as to maintain a distance between the heat conductive member and the component based on a thickness of the solid bonding material when the thermosetting adhesive has fluidity;
• and
• melting the bonding material after the thermosetting adhesive has cured.

A method of mounting a heat conductive member for an electronic component, comprising:

• placing a solid bonding material on an electronic component mounted on a substrate;
• superposing a heat conductive member, so as to interpose a support member a solid thermosetting adhesive between the heat conductive member and the substrate so that the heat conductive member is opposed to a surface of the solid bonding material;
• applying heat to the solid thermosetting adhesive so that the solid thermosetting adhesive liquefies to provide a fluid thermosetting adhesive, thereby bringing the heat conductive member in contact with the surface of the solid bonding material;
• maintaining a temperature equal to or higher than a curing temperature of the fluid thermosetting adhesive and lower than a melting point of the solid bonding material until the fluid thermosetting adhesive has been cured;
• supporting the heat conductive member with only the solid bonding material so as to maintain a distance between the heat conductive member and the electronic component based on thickness of the solid bonding material when the thermosetting adhesive has fluidity;
• and
• melting the solid bonding material at a temperature equal to or higher than the melting point of the solid bonding material after the fluid thermosetting adhesive has cured.