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US 8,709,114 B2Granted
Method of manufacturing chemical mechanical polishing layers
AssigneeRohm and Haas Electronic Materials CMP Holdings, Inc.
InventorsBrian T. Cantrell, Kathleen McHugh, James T. Murnane, George H. McClain, Durron A. Hutt, Robert A. Brady, Christopher A. Young, Jeffrey Borcherdt Miller
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Abstract
A method of manufacturing polishing layers for use in chemical mechanical polishing pads is provided, wherein a plurality of polishing layers are derived from a cake, wherein the formation of density defects in the cake and the surface roughness of the polishing layers formed are minimized.
Claims10
A method of forming a polishing layer for a chemical mechanical polishing pad, comprising:
- providing a mold, having a mold base and a surrounding wall attached to the mold base;
- providing a liner with a top surface, a bottom surface and an average thickness of 2 to 10 cm;
- providing an adhesive;
- providing a curable material comprising a liquid prepolymer;
- providing a nozzle, having a nozzle opening;
- providing a skiver blade with a cutting edge;
- providing a strop;
- providing a stropping compound;
- bonding the bottom surface of the liner to the mold base using the adhesive, wherein the top surface of the liner and the surrounding wall define a mold cavity;
- charging the curable material through the nozzle opening to the mold cavity during a charging period, CP;
- allowing the curable material in the mold cavity to cure into a cake;
- separating the surrounding wall from the mold base and the cake;
- applying the stropping compound to the cutting edge;
- stropping the skiver blade with the strop;
- and,
- slicing the cake into multiple chemical mechanical polishing layers.
13 more elements
Dependencies are inferred from the claim text.