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US 8,708,711 B2Granted
Connecting terminal structure, socket and electronic package
AssigneeShinko Electric Industries Co., Ltd.
InventorYasuyoshi Horikawa
Life of this patent
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Abstract
A connecting terminal structure includes a supporting body; a plurality of first electrode pads provided on a first side of the supporting body; a plurality of second electrode pads provided on a second side of the supporting body; a flexible substrate configured to electrically connect the first electrode pads to the second electrode pads; and a plurality of connecting terminals joined to at least one of the first electrode pads and the second electrode pads.
Claims8
A connecting terminal structure comprising:
- a first substrate having a first surface and a second surface opposite to the first surface;
- a first electrode pad formed on the first surface of the first substrate;
- a second electrode pad formed on the second surface of the first substrate;
- a second substrate having a third surface and a fourth surface opposite to the third surface;
- a third electrode pad formed on the third surface of the second substrate;
- a fourth electrode pad formed on the fourth surface of the second substrate;
- a supporting body provided between the second surface of the first substrate and the third surface of the second substrate, the supporting body directly contacting and being directly connected to an outer peripheral edge of the second surface of the first substrate and an outer peripheral edge of the third surface of the second substrate;
- a flexible substrate arranged so as to electrically connect the second electrode pad formed on the second surface of the first substrate to the third electrode pad formed on the third surface of the second substrate, the flexible substrate being disposed inside an area which is surrounded by the supporting body, the second surface of the first substrate, and the third surface of the second substrate;
- and
- a connecting terminal connected to at least one of the first electrode pad formed on the first surface of the first substrate and the fourth electrode pad formed on the fourth surface of the second substrate;
- wherein the supporting body is made of an insulating material.
8 more elements
Dependencies are inferred from the claim text.