Substrate treating apparatus with inter-unit buffers
AssigneeSokudo Co., Ltd.
InventorsHiroyuki Ogura, Kenya Morinishi, Tsuyoshi Mitsuhashi, Yasuo Kawamatsu, Yoshiteru Fukutomi, Hiromichi Nagashima
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AssigneeSokudo Co., Ltd.
InventorsHiroyuki Ogura, Kenya Morinishi, Tsuyoshi Mitsuhashi, Yasuo Kawamatsu, Yoshiteru Fukutomi, Hiromichi Nagashima
Estimating the term…
The invention provides coating units, heat-treating units, and a first main transport mechanism for transporting substrates to each of these treating units. The substrates are transferred from the first main transport mechanism to a second main transport mechanism through a receiver. When a substrate cannot be placed on the receiver, this substrate is placed on a buffer. Thus, the first main transport mechanism can continue transporting other substrates. The other substrates in the treating units are transported between the treating units without delay, to receive a series of treatments including coating treatment and heat treatment as scheduled. This prevents lowering of the quality of treatment for forming film on the substrates.
A substrate treating apparatus for treating a plurality of substrates comprising:
A substrate treating apparatus comprising:
Dependencies are inferred from the claim text.