Backlight module with heat dissipation structure
AssigneeYoung Lighting Technology Inc.
InventorsHsin-Tse Tsai, Chiao-Chih Yang, Po-Chun Huang
Life of this patent
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Abstract
A backlight module includes a back plate, a light guide plate, a heat insulation layer, a heat dissipation member, and a light source device. The back plate has a first surface, a second surface opposite to the first surface, and an opening passing through the back plate. The light guide plate is disposed on the first surface, the heat insulation layer is disposed on the second surface, and the heat dissipation member is disposed on the heat insulation layer. The light source device is connected to the heat dissipation member and protrudes from the first surface to face the light guide plate through the opening.
Claims13
A backlight module with heat dissipation structure, comprising:
- a back plate, having a first surface, a second surface opposite to the first surface, and an opening passing through the back plate;
- a light guide plate, disposed on the first surface;
- a heat insulation layer, disposed on the second surface;
- a heat dissipation member, disposed under the heat insulation layer without directly connected to the back plate;
- and
- a light source device, connected to the heat dissipation member and protruding from the first surface to directly face the light guide plate through the opening, wherein the light source device is capable of emitting light beams to the light guide plate.
Dependencies are inferred from the claim text.