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US 8,708,461 B2Granted
Thermal resistor fluid ejection assembly
AssigneeHewlett-Packard Development Company, L.P.
InventorsBradley D. Chung, Galen P. Cook, Daniel Fradl
Life of this patent
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Abstract
A thermal resistor fluid ejection assembly includes an insulating substrate and first and second electrodes formed on the substrate. A plurality of individual resistor elements of varying widths are arranged in parallel on the substrate and electrically coupled at a first end to the first electrode and at a second end to the second electrode.
Claims20
A thermal resistor fluid ejection assembly comprising:
- an insulating substrate;
- first and second electrodes formed on the substrate;
- and
- a plurality of individual resistor elements of varying widths arranged in parallel on the substrate and electrically coupled at a first end to the first electrode and at a second end to the second electrode.
1 more element
A fluid ejection device comprising:
- a fluid ejection assembly having a resistor structure with a plurality of resistor elements;
- and
- an uneven nucleation surface having protruding ridges separated by recessed channels and formed as a top layer of the resistor structure to vaporize fluid when heated by the resistor elements, wherein a width of each protruding ridge corresponds with an associated resistor element underlying the nucleation surface.
A thermal resistor structure comprising:
- a plurality of resistor elements coupled in parallel and having non-uniform widths;
- a space between every two resistor elements;
- and
- a thin film layer formed over the resistor elements and the spaces such that a ridge is formed over each resistor element and a channel is formed over each space, the layer forming a nucleation surface to transfer heat from the resistor elements to vaporize fluid in a chamber and eject a fluid drop from the chamber.
1 more element
Dependencies are inferred from the claim text.