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US 8,708,215 B2Granted
Solder ball supplying apparatus
AssigneeSamsung Electro-Machanics Co., Ltd.
InventorsHueng Jae Oh, Yon Ho You, Jin Won Choi
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Abstract
Disclosed herein is a solder ball supplying apparatus including: a cartridge formed in a box shape and having a plurality of solder balls embedded therein; a vibration unit coupled to a lower portion of the cartridge; and a metal mask coupled integrally with a lower portion of the vibration unit and having a plurality of holes formed over the entire surface thereof.
Claims5
A solder ball supplying apparatus, comprising:
- a cartridge formed in a box shape and having a plurality of solder balls embedded therein;
- a vibration unit coupled to a lower portion of the cartridge;
- and
- a metal mask coupled integrally with a lower portion of the vibration unit and having a plurality of holes,
- wherein the vibration unit is mounted at an upper end of a support body, the support body being coupled to an upper portion of the metal mask, such that a movement space of the solder balls is formed under the cartridge.
2 more elements
Dependencies are inferred from the claim text.