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AssigneeShenzhen China Star Optoelectronics Technology Co., Ltd.
InventorsYicheng Kuo, Shihhsiang Chen, Gang Yu, Jiahe Cheng, Zhilin Zhao
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The present invention provides a package cushioning structure for module, which includes a cushioning bottom board and a cushioning band extending through and interlaced with the cushioning bottom board. The cushioning bottom board forms a plurality of spaced hollow sections. A bar is arranged between every two of the hollow sections. The cushioning band includes a plurality of cushioning air columns mounted thereto at interval. The cushioning air columns are arranged alternately on the bars. To package, modules are each positioned on and born by each of the bars between two of the cushioning air columns. An alternate package cushioning structure includes a cushioning bottom board having a surface forming slots and a cushioning band arranged in the cushioning bottom board through a mounting channel extending through the bottom board from a side surface thereof. Air columns of the cushioning band are located in the slots to support modules.
A package cushioning structure for module, comprising a cushioning bottom board and a cushioning band extending through and interlaced with the cushioning bottom board, the cushioning bottom board forming a plurality of spaced hollow sections, a bar being arranged between every two of the hollow sections, the cushioning band comprising a plurality of cushioning air columns mounted thereto at interval, the cushioning air columns being arranged alternately on the bars, whereby to package, modules are each positioned on and born by each of the bars between two of the cushioning air columns.
A package cushioning structure for module, comprising a cushioning bottom board and a cushioning band arranged in the cushioning bottom board, the cushioning bottom board having a top surface forming a plurality of spaced slots, a mounting channel being formed to extend through cushioning bottom board from a side surface of the cushioning bottom board that is parallel to the slots, the slots being in communication with the mounting channel, the cushioning band comprising a plurality of cushioning air columns mounted thereto at interval, the cushioning band being received and retained in the mounting channel in such a way that the cushioning air columns of the cushioning band are located in the slots, whereby to package, modules are respectively disposed in the slots and born by the cushioning air columns.
A package cushioning structure for module, comprising a cushioning bottom board and a cushioning band extending through and interlaced with the cushioning bottom board, the cushioning bottom board forming a plurality of spaced hollow sections, a bar being arranged between every two of the hollow sections, the cushioning band comprising a plurality of cushioning air columns mounted thereto at interval, the cushioning air columns being arranged alternately on the bars, whereby to package, modules are each positioned on and born by each of the bars between two of the cushioning air columns;
Dependencies are inferred from the claim text.