Back to results
US 8,707,974 B2Granted
Wafer cleaning device
AssigneeUnited Microelectronics Corp.
InventorsHsin-Ting Tsai, Cheng-Hung Yu, Chin-Kuang Liu, Ming-Hsin Lee, Wei-Hong Chuang, Kuei-Chang Tung, Yan-Yi Lu, Chin-Chin Wang
Life of this patent
Estimating the term…
Abstract
A wafer cleaning device comprising a wafer stage for holding a wafer having a surface to be washed, a first nozzle positioned above the wafer, a second nozzle positioned above the wafer. A first height is between the first nozzle and the surface and a second height is between the second nozzle and the surface, wherein the first height is shorter than the second height.
Claims12
A wafer cleaning device, comprising:
- a stage for holding a wafer having a surface, wherein the wafer has a center;
- a first nozzle positioned above the wafer, and a first height disposed between the first nozzle and the surface;
- and
- a second nozzle positioned above the wafer, and a second height disposed between the second nozzle and the surface, wherein the first height is shorter than the second height to make a first cleaning solution sprayed from the first nozzle reach the surface earlier than a second cleaning solution sprayed from the second nozzle, and the second nozzle is disposed farther from the center of the wafer than the first nozzle is.
1 more element
Dependencies are inferred from the claim text.