Glass member provided with sealing material layer, electronic device using it and process for producing the electronic device

An electronic device which comprises a first glass substrate having a surface having a first sealing region;

• a second glass substrate having a surface having a second sealing region corresponding to the first sealing region and disposed so that the surface is opposed to the surface of the first glass substrate;
• an electronic element portion provided between the first glass substrate and the second glass substrate;
• and
• a sealing layer formed between the first sealing region of the first glass substrate and the second sealing region of the second glass substrate to seal the electronic element portion and having a thickness of at most 15 μm;
• wherein the sealing layer comprises a melt-bonded layer comprising a fired material of a glass material for sealing containing a sealing glass, a laser absorbent and optionally a low-expansion filler, the total content of the laser absorbent and the low-expansion filler being an optional component being within the range of from 2 to 44 vol %;
• and
• wherein the difference between the thermal expansion coefficient α1 of the material of the sealing layer and the thermal expansion coefficient α2 of at least one of the first glass substrate and the second glass substrate is within the range of from 15 to 65(×10−7/° C.).

A process for producing an electronic device, which comprises a step of preparing a first glass substrate having a surface having a first sealing region;

• a step of preparing a second glass substrate having a surface having a second sealing region corresponding to the first sealing region and provided with a sealing material layer having a thickness of at most 15 μm formed on the second sealing region;
• a step of laminating the first glass substrate and the second glass substrate with the sealing material layer interposed so that the surface of the first glass substrate and the surface of the second glass substrate are opposed to each other;
• and
• a step of irradiating the sealing material layer with a laser light through the first glass substrate or the second glass substrate to melt the sealing material layer thereby to form a sealing layer to seal the electronic element portion provided between the first glass substrate and the second glass substrate;
• wherein the sealing material layer comprises a fired material of a glass material for sealing containing a sealing glass, a laser absorbent and optionally a low-expansion filler, the total content of the laser absorbent and the low-expansion filler being an optional component being within the range of from 2 to 44 vol %;
• and
• wherein the difference of the thermal expansion coefficient α1 of the sealing material layer from the thermal expansion coefficient α2 of at least one of the first glass substrate and the second glass substrate is within the range of from 15 to 65(×10−7/° C.).