Methods and apparatus for cleaning deposition chamber parts using selective spray etch

A method of cleaning an electronic device manufacturing process chamber part, a first portion of the process chamber part being coated with more of a material to be cleaned than a second portion of the process chamber component, the method comprising:

• spraying the part with an acid, wherein spraying the part with an acid comprises directing the acid spray toward the first portion of the part to be cleaned in at least one of:
• (i) in an amount greater than an amount of the acid spray that is directed toward the second portion of the part;
• (ii) over a longer time than a time over which the acid spray is directed toward the second portion of the part;
• and (iii) at a faster flow rate than a flow rate at which the acid spray is directed toward the second portion of the part;
• measuring the temperature of the part;
• comparing the measured temperature to a desired temperature selected to provide a favorable part cleaning rate to part etching rate ratio;
• increasing or decreasing the flow rate of acid to increase or decrease the temperature of the part to maintain the part at the desired temperature;
• spraying the part with de-ionized water;
• and
• treating the part with potassium hydroxide.