US 8,675,364 B2Granted

Power module and power conversion device

AssigneeHitachi Automotive Systems, Ltd.

InventorsTakeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Toshiya Satoh, Hideaki Ishikawa

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Abstract

A power module according to the present invention includes: a semiconductor element for converting DC current to AC current by switching operation; an electrical wiring board to which the semiconductor element is electrically connected, with the semiconductor element being disposed upon one of its principal surfaces; an insulating resin layer provided on the other principal surface of the electrical wiring board; a first insulation layer that is disposed opposite from the electrical wiring board, separated by the insulating resin layer, and that is joined to the insulating resin layer; a second insulation layer that is disposed opposite from the insulating resin layer, separated by the first insulation layer, and that ensures electrical insulation of the semiconductor element; and a metallic heat dissipation member that is disposed opposite from the first insulation layer, separated by the second insulation layer, and that radiates heat generated by the semiconductor element via the electrical wiring board, the insulating resin layer, the first insulation layer, and the second insulation layer.

Claims10

Dependent claims

A power module, comprising:

a semiconductor element for converting DC current to AC current by switching operation;
an electrical wiring board to which the semiconductor element is electrically connected, with the semiconductor element being disposed upon one of principle surfaces of the electrical wiring board;
an insulating resin layer provided on another principal surface of the electrical wiring board;
a first alumite layer that is formed by first alumite processing and is disposed on an opposite side of the electrical wiring board from the semiconductor element, separated by the insulating resin layer, and that is joined to the insulating resin layer;
a second alumite layer that is formed by second alumite processing and is disposed on an opposite side of the insulating resin layer from the semiconductor element, separated by the first alumite layer, and that ensures electrical insulation of the semiconductor element;
and
a metallic heat dissipation member that is disposed on an opposite side of the second alumite layer from the first alumite layer, separated by the second alumite layer, and that radiates heat generated by the semiconductor element via the electrical wiring board, the insulating resin layer, the first alumite layer, and the second alumite layer;
wherein a hole diameter of the first alumite layer is greater than a hole diameter of the second alumite layer;
and
wherein a thickness of the second alumite layer is greater than a thickness of the first alumite layer.

7 more elements

A power module, comprising:

a semiconductor element for converting DC current to AC current by switching operation;
a first electrical wiring board, arranged so as to oppose a first electrode that is on one side of the semiconductor element, and electrically connected to the semiconductor element;
a second electrical wiring board, arranged so as to oppose a second electrode that is on another side of the semiconductor element, and electrically connected to the semiconductor element;
insulating resin layers disposed on both sides of the semiconductor element, with the first and second electrical wiring boards being arranged between the semiconductor element and a respective insulating resin layer;
a first alumite layer formed by first alumite processing for adhering to the insulating resin layer, separated by the insulating resin layer;
a second alumite layer for ensuring electrical insulation of the semiconductor element, separated by the first alumite layer;
and
metallic heat dissipation members for radiating heat generated by the semiconductor element, disposed on both sides of the semiconductor element, each separated by the first electrical wiring board or the second electrical wiring board, the insulating resin layer, the first alumite layer, and the second alumite layer;
wherein a hole diameter of the first alumite layer is greater than a hole diameter of the second alumite layer;
and
wherein a thickness of the second alumite layer is greater than a thickness of the first alumite layer.

8 more elements

A power module, comprising:

a semiconductor element for converting DC current to AC current by switching operation;
a first electrical wiring board, arranged so as to oppose a first electrode that is on one side of the semiconductor element, and electrically connected to the semiconductor element;
a second electrical wiring board, arranged so as to oppose a second electrode that is on another side of the semiconductor element, and electrically connected to the semiconductor element;
a sealing resin mass that seals the semiconductor element, the first electrical wiring board, and the second electrical wiring board, so that portions of surfaces of the first electrical wiring board and the second electrical wiring board that do not face the semiconductor element are exposed;
a metallic casing having an aperture for insertion of the semiconductor element, the first electrical wiring board, and the second electrical wiring board, that is sealed by the sealing resin mass;
and
an insulation sheet that is inserted between an exposed surface of the first electrical wiring board and the second electrical wiring board, and an inner wall of the metallic casing;
wherein, upon the metallic casing, a first alumite layer for adhering to the insulation sheet is formed upon a surface of the metallic casing that faces the insulation sheet and the metallic casing, and a second alumite layer is formed opposite from the insulation sheet, separated by the first alumite layer;
wherein a hole diameter of the first alumite layer is greater than a hole diameter of the second alumite layer;
and
wherein a thickness of the second alumite layer is greater than a thickness of the first alumite layer.

8 more elements

Dependencies are inferred from the claim text.

Facts

Application: 13/266,675Filed 16 Apr 2010
Priority: JP 2009-10865328 Apr 2009
Published: US 2012/0087095 A112 Apr 2012
Granted: 18 Mar 2014
Term ends: Not estimatedThe source records don’t support an estimate.

Classification37 codes

H10W 40/43
Involving heat exchange by flowing fluids: by flowing gases, e.g. forced air cooling
B60K 6/365
Characterised by the transmission gearings: with the gears having orbital motion
B60K 6/445
Series-parallel type: differential gearing distribution type
B60L 3/003
Detecting, eliminating, remedying or compensating for drive train abnormalities, e.g. failures within the drive train: relating to inverters