Method of manufacturing a circuit board
AssigneeIntel Corporation
InventorsDavid Shykind, James A. McCall
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a circuit board is described herein. The method may include adding a resin, forming first and second fiberglass fibers, and forming first and second signal line traces capable of transmitting electrical signals. In some examples, a ratio between fiberglass and resin material near the first signal line trace is similar to a ratio between fiberglass and resin material near the second signal line trace. In some examples, the first and second fiberglass fibers diagonally cross near the first and second signal line traces. In some examples, the first and second fiberglass fibers cross near the first and second signal line traces in a zig-zag pattern.
Claims21
A method of manufacturing a circuit board comprising:
- adding a resin;
- forming first and second fiberglass fibers;
- and
- forming first and second signal line traces capable of transmitting electrical signals;
- wherein a ratio between fiberglass and resin material near the first signal line trace is similar to a ratio between fiberglass and resin material near the second signal line trace, wherein the first and second fiberglass fibers form a non-right angle with a cut line of the circuit board, and wherein the first and second signal line traces are capable of transmitting electrical signals at one gigahertz and above.
A method of manufacturing a circuit board comprising:
- adding a resin;
- forming first and second fiberglass fibers;
- and
- forming first and second signal line traces capable of transmitting electrical signals;
- wherein the first and second fiberglass fibers diagonally cross near the first and second signal line traces, wherein a ratio between fiberglass and resin material near the first signal line trace is similar to a ratio between fiberglass and resin material near the second signal line trace, wherein the first and second fiberglass fibers form a non-right angle with a cut line of the circuit board, and wherein the first and second signal line traces are capable of transmitting electrical signals at one gigahertz and above.
A method of manufacturing a circuit board comprising:
- adding a resin;
- forming first and second fiberglass fibers;
- and
- forming first and second signal line traces capable of transmitting electrical signals;
- wherein the first and second fiberglass fibers cross near the first and second signal line traces in a zig-zag pattern, wherein a ratio between fiberglass and resin material near the first signal line trace is similar to a ratio between fiberglass and resin material near the second signal line trace, wherein the first and second fiberglass fibers form a non-right angle with a cut line of the circuit board, and wherein the first and second signal line traces are capable of transmitting electrical signals at one gigahertz and above.
Dependencies are inferred from the claim text.