# US 8,666,551 B2 · Semiconductor-processing apparatus equipped with robot diagnostic module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,666,551 B2 - Document ID: US8666551B2 - Status: Granted - Kind: B2 - Application number: 12/341,869 - Filed: 2008-12-22 - Published: 2010-06-24 - Granted: 2014-03-04 - Earliest claimed: 2008-12-22 - Assignees: ASM Japan K.K. - Applicants: Masahiro Takizawa; Teruhide Nishino - Inventors: Masahiro Takizawa; Teruhide Nishino - Web page: https://patentgrep.com/patent/US8666551B2 ## CPC - B25J 9/1692: {Calibration of manipulator} - H10P 72/0608: {of substrates stored in a container, a magazine, a carrier, a boat or the like} - H10P 72/3302: {Mechanical parts of transfer devices} - H10P 72/7602: {the wafers being placed on a robot blade or gripped by a gripper for conveyance} - G05B 2219/37125: Photosensor, as contactless analog position sensor, signal as function of position - G05B 2219/37608: Center and diameter of hole, wafer, object - B25J: MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES ({manipulators specially adapted for use in surgery A61B34/70; manipulators used in cleaning hollow articles B08B9/04}; manipulators associated with rolling mills B21B39/20; manipulators associated with forging machines B21J13/10; {manipulators associated with picking-up and placing mechanisms B23P19/007}; means for holding wheels or parts thereof B60B30/00; {vehicles with ground-engaging propulsion means, e.g. walking members B62D57/02, B62D57/032; devices for picking-up and depositing articles or materials between conveyors B65G47/90, B65G47/91; manipulators with gripping or holding means for transferring packages B65H67/065}; cranes B66C; {manipulators used in the protection or supervision of pipe-line installations F17D5/00; walking equipment adapted for nuclear steam-generators F22B37/006}; manipulators specially adapted for, or associated with, nuclear reactors G21C; {apparatus used for handling wafers during manufacture or treatment of semiconductor H10P72/50}) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - G05B: CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS (systems for controlling or regulating non-electric variables G05D; systems for regulating electric or magnetic variables G05F; control devices or systems insofar as characterised by mechanical features only G05G) ## Abstract A semiconductor wafer manufacturing apparatus is equipped with a diagnostic module for diagnosing integrity of a transfer robot. The diagnostic module is attached to one side of a semiconductor wafer transfer chamber provided with the transfer robot, which side is also used for the purpose of maintenance, for example. One or more sensors are installed in the diagnostic module so that when the transfer robot is inserted into the diagnostic module, the position or shape of each end effector of the transfer robot is detected and compared against a pre-registered normal condition, thereby diagnosing the integrity of the end effector of the transfer robot, while performing wafer processing. ## Claims ### Claim 1 A semiconductor-processing apparatus comprising: a wafer transfer chamber provided with a wafer transfer robot therein, said wafer transfer robot having an end effector for carrying a wafer, said wafer transfer chamber having multiple sides for attaching chambers thereto; at least one reactor attached to one side of the wafer transfer chamber, and accessible to the wafer transfer robot; and a robot diagnostic module being a chamber shaped like the at least one reactor which is attached to another side of the wafer transfer chamber and accessible to the wafer transfer robot to diagnose the transfer robot inside the robot diagnostic module while a wafer is being processed in the at least one reactor and the end effector of the transfer robot is empty-handed or carrying a wafer, said robot diagnostic module being incapable of performing any processing of semiconductor wafers and comprising at least one sensor attached thereto for detecting a position of the end effector when the end effector is located inside the robot diagnostic module, wherein a relative position of the transfer robot at each reactor can be recreated inside the robot diagnostic module. ### Claim 2 (depends on 1) The semiconductor-processing apparatus according to claim 1, further comprising a controller operating the reactor, the wafer transfer robot, and the robot diagnostic module, storing data on a reference position of the end effector, and comparing the detected position with the reference position, thereby detecting a deviation of the end effector, if any. ### Claim 3 (depends on 1) The semiconductor-processing apparatus according to claim 1, wherein the sensor is disposed in the robot diagnostic module at a position to detect a distal end of the end effector. ### Claim 4 (depends on 1) The semiconductor-processing apparatus according to claim 1, wherein the sensor is a photosensor comprised of a light emission unit for emitting light and a light receiving unit for receiving light from the light emission unit, wherein the end effector is inserted between the light emission unit and the light receiving unit and blocks the light from the light emission unit, thereby changing an illuminance received by the light receiving unit, wherein the data on the reference position stored in the controller is a reference illuminance, and the controller compares the illuminance received by the light receiving unit with the reference illuminance, thereby detecting a deviation of the end effector, if any. ### Claim 5 (depends on 1) The semiconductor-processing apparatus according to claim 1, wherein the sensor is a planar photosensor capable of detecting a shape of a distal end of the end effector, the data on the reference position stored in the controller is a reference shape of the distal end of the end effector, and the controller compares the detected shape of the distal end of the end effector with the reference shape, thereby detecting a deviation of the end effector, if any. ### Claim 6 (depends on 1) The semiconductor-processing apparatus according to claim 1, wherein the at least one sensor comprises at least a first sensor and a second sensor, said first sensor being disposed at a position to detect a vertical position of a distal end of the end effector, said second sensor being disposed at a position to detect a horizontal position of the distal end of the end effector, wherein the data on the reference position stored in the controller include a reference illuminance for the first sensor and a reference illuminance for the second sensor, and the controller compares an illuminance detected by the first sensor when the end effector is located inside the robot diagnostic module with the reference illuminance for the first sensor, and the controller compares an illuminance detected by the second sensor when the end effector is located inside the robot diagnostic module with the reference illuminance for the second sensor, thereby detecting a deviation of the end effector. ### Claim 7 (depends on 1) The semiconductor-processing apparatus according to claim 1, wherein said other side of the wafer transfer chamber is used for maintenance of the apparatus. ### Claim 8 (depends on 7) The semiconductor-processing apparatus according to claim 7, wherein the robot diagnostic module is detachable from the other side when the apparatus is subjected to maintenance. ### Claim 9 (depends on 2) The semiconductor-processing apparatus according to claim 2, wherein the controller inserts the end effector of the wafer transfer robot inside the robot diagnostic module and detects a deviation of the end effector of the wafer transfer robot while a wafer is being processed in the reactor. ### Claim 10 (depends on 1) The semiconductor-processing apparatus according to claim 1, wherein the controller stops processing a wafer when a deviation of the end effector is detected in the robot diagnostic module. ### Claim 11 (depends on 1) The semiconductor-processing apparatus according to claim 1, wherein the sensor is disposed at a position to detect a position of the end effector when the end effector is extended as if the end effector loads/unloads a wafer to/from the reactor. ### Claim 12 A method for inhibiting defective wafers from being manufactured by detecting a deviation of an end effector of a wafer transfer robot for a semiconductor-processing apparatus that comprises: (i) a wafer transfer chamber provided with the wafer transfer robot therein, said wafer transfer chamber having multiple sides for attaching chambers thereto, (ii) at least one reactor attached to one side of the wafer transfer chamber and accessible to the wafer transfer robot, and (iii) a robot diagnostic module being a chamber shaped like the at least one reactor attached to another side of the wafer transfer chamber and accessible to the wafer transfer robot for diagnosing the transfer robot, said robot diagnostic module said robot diagnostic module being incapable of performing any processing of semiconductor wafers and comprising at least one sensor attached thereto for detecting a position of the end effector when the end effector is located inside the robot diagnostic module, wherein a relative position of the transfer robot at each reactor can be recreated inside the robot diagnostic module, said method comprising, while a wafer is being processed in the at least one reactor and the end effector of the wafer transfer robot is empty-handed or carrying a wafer: placing the end effector of the wafer transfer robot inside the robot diagnostic module; detecting a position of the end effector using the sensor; comparing the detected position with a pre-recorded reference position, thereby detecting a deviation of the end effector; and stopping processing a wafer when a deviation of the end effector is detected in the robot diagnostic module when comparing the detected position with the pre-recorded reference position. ### Claim 13 (depends on 12) The method according to claim 12, wherein detecting the position of the end effector comprises detecting a position of a distal end of the end effector. ### Claim 14 (depends on 12) The method according to claim 12, wherein the sensor is a photosensor comprised of a light emission unit for emitting light and a light receiving unit for receiving light from the light emission unit, wherein the end effector is inserted between the light emission unit and the light receiving unit and blocks the light from the light emission unit, thereby changing an illuminance received by the light receiving unit, wherein detecting the position of the end effector comprises detecting an illuminance received by the light receiving unit, and comparing the detected position with the pre-recorded reference position comprises comparing the detected illuminance with a reference illuminance. ### Claim 15 (depends on 12) The method according to claim 12, wherein the sensor is a planar photosensor capable of detecting a shape of a distal end of the end effector, wherein detecting the position of the end effector comprises detecting a shape of the distal end of the end effector, and comparing the detected position with the pre-recorded reference position comprises comparing the detected shape of the distal end of the end effector with a reference shape. ### Claim 16 (depends on 12) The method according to claim 12, wherein the at least one sensor comprises at least a first sensor and a second sensor, said first sensor being disposed at a position to detect a vertical position of a distal end of the end effector, said second sensor being disposed at a position to detect a horizontal position of the distal end of the end effector, wherein detecting the position of the end effector comprises detecting an illuminance by the first sensor and an illuminance by the second sensor, and comparing the detected position with the pre-recorded reference position comprises comparing the detected illuminance by the first sensor with a reference illuminance and comparing the detected illuminance by the second sensor with a reference illuminance. ### Claim 17 (depends on 12) The method according to claim 12, wherein placing the end effector of the wafer comprises transferring the wafer transfer robot inside the robot diagnostic module while a wafer is being processed in the reactor. ### Claim 18 (depends on 12) The method according to claim 12, wherein the steps for detecting the deviation of the end effector are conducted when the wafer transfer robot is to be on standby so as to detect the deviation of the end effector without affecting the throughput of wafers by the semiconductor-processing apparatus.