Cutting method and cutting device for hard material
AssigneeToshiba Kikai Kabushiki Kaisha
InventorsKunitaka Kuriyama, Masahiko Fukuta, Katsuhiko Sekiya, Yasuo Yamane
Life of this patent
Estimating the term…
Abstract
A method of cutting a workpiece made of a highly-hard material is provided. The workpiece is cut by a machining device including a workpiece holder that holds the workpiece, a spindle device that rotates the workpiece holder, a tool holder that holds a tool, and a relative moving mechanism that relatively moves the workpiece holder and the tool holder at least in two axial directions orthogonal to each other. In the machining device, positioning errors in the axial directions are within 5 nm.
Claims3
A method of cutting a workpiece made of a highly hard material, comprising
- cutting the workpiece using a machining device comprising:
- a workpiece holder that holds the workpiece;
- a tool holder that holds a tool;
- a rotation drive mechanism that rotates the workpiece holder;
- and a relative moving mechanism that relatively moves the workpiece holder and the tool holder at least in two axial directions orthogonal to each other,
- wherein positioning errors of the machining device in the axial directions of the relative moving mechanism are 5 nm or less;
- the tool is made of a single crystal or multicrystal diamond;
- the workpiece is cut while a rotating speed of the rotation drive mechanism and a movement of the relative moving mechanism are controlled so that a chip thickness of the workpiece cut by the tool is 20 to 60 nm;
- the relative moving mechanism includes:
- a fixed member;
- a moving member that moves relative to the fixed member;
- a guide mechanism provided between the fixed member and the moving member;
- and a linear drive mechanism that moves the moving member relative to the fixed member,
- the linear drive mechanism is provided by a linear motor mechanism, and
- the guide mechanism is a rolling guide mechanism including:
- a pair of V-grooves parallely provided on the fixed member along a moving direction of the moving member and spaced away from each other;
- V-shaped ridges protruding from the moving member that are opposing to the V-grooves;
- and rolling members interposed between inclined surfaces of the V-grooves and the ridges.
A cutting device for cutting a workpiece made of a highly-hard material, comprising:
- a workpiece holder that holds the workpiece during cutting;
- a tool holder that holds a tool during cutting;
- a rotation drive mechanism that rotates the workpiece holder;
- a relative moving mechanism that relatively moves the workpiece holder and the tool holder at least in two axial directions orthogonal to each other,
- wherein positioning errors of the cutting device in the axial directions of the relative moving mechanism are 5 nm or less;
- the tool is made of a single crystal or multicrystal diamond;
- the workpiece is cut while a rotating speed of the rotation drive mechanism and a movement of the relative moving mechanism are controlled so that a chip thickness of the workpiece cut by the tool is 20 to 60 nm;
- the relative moving mechanism includes:
- a fixed member;
- a moving member that moves relative to the fixed member;
- a guide mechanism provided between the fixed member and the moving member;
- and a linear drive mechanism that moves the moving member relative to the fixed member,
- the linear drive mechanism is provided by a linear motor mechanism, and
- the guide mechanism is a rolling guide mechanism including:
- a pair of V-grooves parallely provided on the fixed member along a moving direction of the moving member and spaced away from each other;
- ridges protruding from the moving member to define V-shapes that are opposing to the V-grooves;
- and rolling members interposed between inclined surfaces of the V-grooves and the ridges.
Dependencies are inferred from the claim text.