Systems and methods for processing ribbon and wire in ultrasonic bonding systems
AssigneeOrthodyne Electronics Corporation
InventorVahid Safavi Ardebili
Life of this patent
Estimating the term…
Abstract
An ultrasonic bonding system is provided. The system includes: a) a bond head assembly carrying an ultrasonic bonding tool; b) a conductive material supply; c) a conductive material feeding system for guiding a length of the conductive material supply to a position proximate the ultrasonic bonding tool; and d) a vapor generation system for supplying a vapor proximate the ultrasonic bonding tool, the vapor including a carrier gas and a lubricating vapor.
Claims18
An ultrasonic bonding system comprising:
- a) a bond head assembly carrying an ultrasonic bonding tool;
- b) a conductive material supply;
- c) a conductive material feeding system for guiding a length of the conductive material supply to a position proximate the ultrasonic bonding tool;
- and
- d) a vapor generation system for supplying a vapor proximate the ultrasonic bonding tool, the vapor including a carrier gas and a lubricating vapor, wherein the lubricating vapor comprises methanol.
An ultrasonic bonding system comprising:
- a) a bond head assembly carrying an ultrasonic bonding tool;
- b) a conductive material supply;
- c) a conductive material feeding structure for guiding a length of a conductive material from the conductive material supply to a position proximate the ultrasonic bonding tool;
- and
- d) a vapor generation system for supplying a vapor to the conductive material feeding structure, the vapor including a carrier gas and a lubricating vapor.
A system for processing a conductive material, the system comprising:
- a conductive material supply;
- a dispenser for dispensing a silane compound to a length of conductive material fed from the conductive material supply;
- and a curing mechanism for curing the silane compound on the length of the conductive material,
- wherein the dispenser includes at least one of:
- (a) a vapor dispenser for dispensing the silane compound as a vapor;
- and (b) a liquid dispenser for dispensing the silane compound as a liquid.
A method of processing a conductive material in connection with an ultrasonic bonding system, the method comprising the steps of:
- a) providing a length of the conductive material from a conductive material supply on the ultrasonic bonding system, and guiding the length of the conductive material through a conductive material feeding structure positioned between (1) the conductive material supply and (2) a position proximate an ultrasonic bonding tool of the ultrasonic bonding system;
- and
- b) supplying a vapor from a vapor generation system to a portion of the conductive material in the conductive material feeding structure on the ultrasonic bonding system, the vapor including a carrier gas and a lubricating vapor.
Dependencies are inferred from the claim text.