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US 8,650,927 B1Granted
Forming device for thixoextrusion and method thereof
AssigneeKorea Institute of Industrial Technology
InventorsShea Kwang Kim, Young Ok Yoon, Dong In Jang
Life of this patent
Estimating the term…
Abstract
According to the apparatus and method, metals can be molded under a low extrusion pressure, the life of the apparatus is prolonged, the strength of the metal products is improved, the ignition of the metals is inhibited during processing, the amount of a protective gas used is reduced, and the formation of welding lines is inhibited.
Claims20
A thixoextrusion molding apparatus, comprising:
- a container having a first through-hole storing 10 to 30 parts weight of a semi-solid billet therein and a heater installed outside the first through-hole to maintain the temperature of the semi-billet constant;
- a stem insertable into the first through-hole from the front of the container to pressurize the semi-solid billet in the backward direction;
- a die ring coupled to the back of the container and having a plurality of coolant inflow/outflow holes to prevent thermal deformation in the circumferential direction;
- a die body disposed inside the die ring and having a second through-hole, which is in communication with the first through-hole of the container and has a smaller diameter than the first through-hole of the container, through which the semi-solid billet is extruded and a plurality of thermocouple insertion holes for measuring the temperature of the semi-solid billet;
- a die body support coupled to the back of the die body inside the die ring and having a plurality of coolant inflow/outflow holes so as to change the phase of the extruded semi-solid billet to a solid extrudate;
- a die balance support held in close contact with the die body support and coupled to the back of the die ring;
- and
- a cooling unit coupled to the die balance support to cool the solid extrudate.
5 more elements
A thixoextrusion molding apparatus, comprising:
- a container having a first through-hole storing a semi-solid billet and a heater embedded in the container;
- a stem insertable into the first through-hole to pressurize the semi-solid billet;
- a die ring coupled to the back of the container and having a plurality of coolant inflow/outflow holes;
- a die body disposed inside the die ring and having a second through-hole, which is in communication with the first through-hole of the container and has a smaller diameter than the first through-hole of the container, through which the semi-solid billet is extruded and a plurality of thermocouple insertion holes;
- a die body support coupled to the back of the die body inside the die ring and having a plurality of coolant inflow/outflow holes;
- a die balance support held in close contact with the die body support and coupled to the back of the die ring;
- and
- a cooling unit coupled to the die balance support.
5 more elements
Dependencies are inferred from the claim text.