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US 8,642,488 B2Granted
Multi-step system and method for curing a dielectric film
AssigneeTokyo Electron Limited
InventorsJunjun Liu, Eric M. Lee, Dorel L. Toma
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Abstract
A multi-step system and method for curing a dielectric film in which the system includes a drying system configured to reduce the amount of contaminants, such as moisture, in the dielectric film. The system further includes a curing system coupled to the drying system, and configured to treat the dielectric film with ultraviolet (UV) radiation and infrared (IR) radiation in order to cure the dielectric film.
Claims18
A method of treating a dielectric film on a substrate, comprising:
- disposing said substrate in a curing system;
- and
- curing said dielectric film by:
- exposing said dielectric film to infrared (IR) radiation ranging from approximately 8 microns to approximately 14 microns to facilitate cross-linking by thermal energy sufficient for bond formation and reorganization during one stage of said curing, and
- exposing said dielectric film to ultraviolet (UV) radiation ranging from approximately 100nm to approximately 600nm to also perform at least one of generating cross-link initiators by bond dissociation and facilitating porogen burn out during another stage of said curing said dielectric film, wherein at least part of said exposing to IR radiation and said exposing to UV radiation is performed simultaneously.
2 more elements
Dependencies are inferred from the claim text.