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AssigneeDowa Electronics Materials Co., Ltd.
InventorsKeiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Nagahara, Toshihiko Ueyama
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Provided is a bonding material which enables formation of a bonded article in nitrogen, and can exhibit bonding strength to withstand practical use while having reduced bonding fluctuations between samples without a heat treatment procedure under pressurized or high temperature conditions. The bonding material comprises: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic substance having 8 carbon atoms or less; a dispersion medium having a boiling point of 230° C. or higher; and a flux component including an organic matter having at least two carboxyl groups. Particularly, it is preferable to use the silver nanoparticles and submicron silver particles in combination.
A bonding material, comprising silver nanoparticles having an average primary particle diameter of 1 to 200 nm coated with an organic substance having 8 carbon atoms or less, a dispersion medium having a boiling point of 230° C. or higher, and submicron silver particles having an average particle diameter of 0.5 to 3.0 μm.
A bonding material, comprising silver particles having an average primary particle diameter of 1 to 200 nm coated with an organic substance having 8 carbon atoms or less, a dispersion medium having a boiling point of 230° C. or higher, and an organic matter having at least two carboxyl groups as a flux component.
A method for bonding two different substances, comprising the steps of:
Dependencies are inferred from the claim text.