Method and solder for form-fitted joining of two surfaces
AssigneeStorz Endoskop Produktions GmbH
InventorBeat Krattiger
Life of this patent
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Abstract
A method for adhesive bond joining of two surfaces, where a metallic or non-metallic solder is applied to at least one of the two surfaces, where the solder has a temperature-dependent optical property. The solder is radiated with electromagnetic radiation with a predetermined spectrum, such that the solder reaches a predetermined temperature above its melting temperature and moistens the surfaces, such that the temperature-dependent optical property is modified reversibly or irreversibly at the predetermined temperature of the solder. The solder is cooled to below its melting temperature, such that the solder solidifies and connects the surfaces in an adhesive bond.
Claims11
A method for adhesive bond joining of two surfaces comprising the following steps:
- apply a metallic or non-metallic solder to at least one of the two surfaces, such that the solder has a temperature-dependent optical property for electromagnetic radiation with a predetermined spectrum in the infrared spectral range;
- radiate the solder with electromagnetic radiation with a predetermined spectrum in the infrared spectral range, such that the solder reaches a predetermined temperature above its melting temperature and moistens the surfaces by the molten solder, such that the temperature-dependent optical property is reversibly or irreversibly modified at the predetermined temperature of the solder, such that absorption constant of the solder decreases upon heating the solder;
- cool the solder below its melting temperature, such that the solder solidifies and connects the surfaces in adhesive bond manner.
Dependencies are inferred from the claim text.