Methods of testing packaged thin-film piezoelectric-on-semiconductor microelectromechanical resonators having hermetic seals
AssigneeIntegrated Device Technology, Inc.
InventorYe Wang
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Abstract
Methods of testing packaged thin-film piezoelectric-on-semiconductor (TPoS) microelectromechanical resonators having hermetic seals include measuring a quality factor (Q) of resonance of the packaged resonator at at least two unequal temperatures to determine whether a ΔQ/ΔT is significantly different (e.g, by at least 50%) over a temperature range (ΔT) spanning a smallest and largest of the at least two temperatures. These measurements are performed for a packaged resonator having a QAIR<QTED, where QAIR is the quality factor of resonance of the packaged resonator due to air damping and QTED is the quality factor of resonance of the packaged resonator due to thermoelastic damping.
Claims4
A method of testing a packaged thin-film piezoelectric-on-semiconductor microelectromechanical resonator, comprising:
- measuring a quality factor of resonance (Q) of the packaged resonator at at least two unequal temperatures to determine a change in quality factor (EQ) over a temperature range (ΔT) spanning a smallest and largest of the at least two temperatures, for a packaged resonator having a QAIR<QTED, where QAIR is the quality factor of resonance of the packaged resonator due to air damping and QTED is the quality factor of resonance of the packaged resonator due to thermoelastic damping, said measuring comprising determining that the packaged resonator has a defective hermetic seal in the event a ΔQ/ΔT of the packaged resonator is at least 50% different than an otherwise equivalent packaged resonator having a hermetic seal.
Dependencies are inferred from the claim text.