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AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsTony Maindron, Christophe Prat
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The invention relates to an organic optoelectronic device, such as a display, lighting or signalling device, that is protected from the ambient air by a sealed encapsulation in the form of a thin film, and to a method for encapsulating such a device. An optoelectronic device (1) according to the invention is coated with a sealed multi-layer encapsulation structure (20) comprising alternating inorganic layers (21a to 26a) and organic layers (21b to 25b). According to the invention, the device is such that at least one of said organic layers consists of a crosslinked adhesive film (21b to 25b) based on a glue that can be crosslinked thermally or by electromagnetic radiation, the or each adhesive film having a thickness uniformly lower than 200 n, said thickness being obtained by passing the film, which is deposited and not yet cross-linked, through a vacuum, such that the total thickness of the encapsulation structure is minimized.
An organic optoelectronic device comprising organic light-emitting diodes (OLEDs), photovoltaic cells or organic thin-film transistors (TFTs), said device being coated with an impermeable multilayer encapsulation structure comprising an alternation of inorganic layers and organic layers, wherein at least one of these organic layers is formed by a cured adhesive film based on an electromagnetic-radiation-curable or heat-curable adhesive, the or each adhesive film having a thickness uniformly less than 200 nm, which thickness is obtained by exposing the as yet uncured deposited film to vacuum so that the total thickness of the encapsulation structure is minimized.
Dependencies are inferred from the claim text.