Process for producing photosensitive resin plate and relief printing plate having recessed and projected pattern, and plate surface treating liquid used in the process

A process for producing a photosensitive resin plate having a recessed and projected pattern or a relief printing plate having a recessed and projected pattern, the process comprising the steps of:

• making a solution containing an ink-repellent component (A) and a curing component (B) attach to a plate surface of the photosensitive resin plate or the relief printing plate having a recessed and projected pattern;
• and subjecting the printing plate to post-treatment, wherein
• the post-treatment step is treatment selected from the group consisting of heat treatment, post-exposure treatment with an active light source, and electron beam treatment;
• and
• the ink-repellent component (A) comprises at least one fluorine-based compound, the curing component (B) comprises radical reactive groups, and an equivalent weight of the radical reactive groups in the ink-repellent component (A) and the curing component (B) is 3,500 g/mol or less, wherein the radical reactive groups are allyl groups.