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US 8,629,539 B2Granted
Methods and apparatus for magnetic sensor having non-conductive die paddle
AssigneeAllegro MicroSystems, LLC
InventorsShaun D. Milano, Michael C. Doogue, William P. Taylor
Life of this patent
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Abstract
Methods and apparatus to provide an integrated circuit package having a conductive leadframe, a non-conductive die paddle mechanically coupled to the leadframe, and a die disposed on the die paddle and electrically connected to the leadframe. With this arrangement, eddy currents are reduced near the magnetic field transducer to reduce interference with magnetic fields.
Claims25
A device, comprising:
- a conductive leadframe;
- a non-conductive die paddle positioned in relation to the leadframe;
- a die disposed on the die paddle;
- at least one electrical connection from the die to the leadframe;
- and
- a magnetic layer with the die to affect magnetic fields proximate the die.
3 more elements
A method, comprising:
- employing a conductive leadframe;
- forming a non-conductive die paddle in relation to the leadframe;
- placing a die on the non-conductive die paddle to form an assembly;
- forming at least one electrical connection between the die and the leadframe;
- overmolding the assembly to form an integrated circuit package;
- and
- forming a magnetic layer aligned with the die.
4 more elements
Dependencies are inferred from the claim text.