Reduction of entrance and exit marks left by a substrate-processing meniscus

A method for processing a substrate, comprising:

• moving a substrate in a linear direction simultaneously between a processing face of an upper proximity head and a processing face of a lower proximity head;
• and
• as the substrate is moved in the linear direction simultaneously between the processing faces of the upper and lower proximity heads, generating a first meniscus of processing liquid between the processing face of the upper proximity head and a top surface of the substrate, and generating a second meniscus of processing liquid between the processing face of the lower proximity head and a bottom surface of the substrate,
• wherein the first meniscus is generated to have a first meniscus protrusion that extends in the linear direction in which the substrate is moved and is positioned on a trailing side of the first meniscus relative to the linear direction in which the substrate is moved, and
• wherein the first meniscus protrusion is centered on the substrate relative to a diameter of the substrate as measured perpendicular to the linear direction in which the substrate is moved.