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US 8,620,014 B2Granted
Microphone
AssigneeOMRON Corporation
InventorsTomofumi Maekawa, Naoto Kuratani, Tsuyoshi Hamaguchi
Life of this patent
Estimating the term…
Abstract
A miniaturized microphone maintaining the properties of a microphone chip and achieving a smaller mounting area. The microphone includes a package which includes a first and second member. At least one of the first second members includes a recess. The microphone also includes a circuit element installed on an inner surface of the first member. Additionally, the microphone includes a microphone chip arranged on a surface on an opposite side of an installing surface of the circuit element.
Claims29
A microphone comprising:
- a package including a cover and a substrate, at least one of which has a recess;
- a circuit element installed on an inner surface of the cover;
- wherein the circuit element is arranged on the surface of a microphone chip on which a diaphragm is arranged and the circuit element is arranged outside the area where the diaphragm is arranged;
- wherein the microphone further comprises:
- a microphone terminal arranged on the microphone chip and a plurality of input/output terminals arranged on the circuit element,
- wherein the microphone terminal and some of the plurality of input/output terminals are connected by a wire wiring,
- wherein the remaining input/output terminals arranged on the circuit element and a pad portion arranged on a surface facing the substrate of the cover are connected by a wire wiring, and
- wherein the pad portion arranged on the cover and a pad portion arranged on the substrate are joined by a conductive material.
5 more elements
A microphone comprising:
- a package including a cover and a substrate, at least one of which has a recess;
- a microphone chip installed on an inner surface of the cover;
- and
- a circuit element arranged on a surface of the microphone chip on an opposite side of an installing surface of the microphone chip, wherein the circuit element is arranged on the surface of the microphone chip on which a diaphragm is arranged and the circuit element is arranged outside the area where the diaphragm is arranged;
- wherein the microphone further comprises:
- a microphone terminal arranged on the microphone chip and a plurality of input/output terminals arranged on the circuit element,
- wherein the microphone terminal and some of the plurality of input/output terminals are connected by a wire wiring,
- wherein the remaining input/output terminals arranged on the circuit element and a pad portion arranged on a surface facing the substrate of the cover are connected by a wire wiring, and
- wherein the pad portion arranged on the cover and a pad portion arranged on the substrate are joined by a conductive material.
6 more elements
A microphone comprising:
- a package including a cover and a substrate, at least one of which has a recess;
- a circuit element installed on an inner surface of the cover;
- wherein the circuit element is arranged on the surface of a microphone chip on which a diaphragm is arranged and the circuit element is arranged outside the area where the diaphragm is arranged;
- wherein the microphone further comprises:
- a microphone terminal arranged on the microphone chip and a plurality of input/output terminals arranged on the circuit element,
- wherein the microphone terminal and some of the plurality of input/output terminals are connected by a through-wiring arranged in the microphone chip,
- wherein the remaining input/output terminals arranged on the circuit element and a pad portion arranged on a surface facing the substrate of the cover are connected by a wire wiring, and
- wherein the pad portion arranged on the cover and a pad portion arranged on the substrate are joined by a conductive material.
5 more elements
A microphone comprising:
- a package including a cover and a substrate, at least one of which has a recess;
- a microphone chip installed on an inner surface of the cover;
- and
- a circuit element arranged on a surface of the microphone chip on an opposite side of an installing surface of the microphone chip, wherein the circuit element is arranged on the surface of the microphone chip on which a diaphragm is arranged and the circuit element is arranged outside the area where the diaphragm is arranged;
- wherein the microphone further comprises:
- a microphone terminal arranged on the microphone chip and a plurality of input/output terminals arranged on the circuit element,
- wherein the microphone terminal and some of the plurality of input/output terminals are connected by a through-wiring arranged in the circuit element,
- wherein the remaining input/output terminals arranged on the circuit element and a pad portion arranged on a surface facing the substrate of the cover are connected by a wire wiring, and
- wherein the pad portion arranged on the cover and a pad portion arranged on the substrate are joined by a conductive material.
6 more elements
Dependencies are inferred from the claim text.