Implementing high-speed signaling via dedicated printed circuit-board media

An apparatus comprising:

• a first circuit board configured to include a first electronic component and a second electronic component, said first circuit board including a plurality of pins associated with a plurality of leads for the first electronic component, said first circuit board including a first layer on which first wires are formed, and said first wires connecting to a first portion of the plurality of pins;
• a second circuit board affixed to the first circuit board, said second circuit board including a second layer on which second wires are formed, and said second circuit board being limited in size to approximately a distance between the first electronic component and the second electronic component;
• and
• a plurality of electrical connectors that extend through a thickness of the first circuit board and connect a second portion of the plurality of pins to the second wires on the second layer, wherein the second circuit board is smaller than the first circuit board, and wherein the second wires are configured to have a spatial configuration and wire width sufficient to extend up to approximately 30 inches in length with a signal-to-cross talk ratio of greater than 17 decibels and a signal attenuation of less than or equal to 12 decibels for signal communications at greater than or equal to approximately 5 Gigabits per second for single-ended signaling.

A printed circuit board assembly for single ended signaling, the printed circuit board assembly comprising:

• first electronic components configured to communicate with each other at signal speeds greater than or equal to approximately 5 Gigabits per second;
• a first printed circuit board to which the first electronic components are attached, said first printed circuit board having a first set of wires that connect the first electronic components to second electronic components also attached to the first printed circuit board;
• and
• a second printed circuit board affixed to the first printed circuit board to which the first electronic components are attached, wherein electrical connectors extend through the first printed circuit board and connect the first electronic components to a second set of wires formed on the second printed circuit board, wherein the second printed circuit board is smaller than the first printed circuit board, and wherein the second set of wires are configured to have a spatial configuration on the second printed circuit board sufficient to extend up to approximately 30 inches in distance with a signal-to-cross talk ratio of greater than 17 decibels and a signal attenuation of less than or equal to 12 decibels.