Three-dimensional system-in-package package-on-package structure

A three-dimensional package structure, comprising:

• at least one first electronic device with first die pads;
• a support element formed around said at least one first electronic device;
• a filling material filled between said at least one first electronic device and said support element, wherein top surfaces of said at least one first electronic device, said support element and said filling material are coplanar;
• a dielectric layer formed on said at least one first electronic device, said support element and said filling material to expose said first die pads;
• signal channels formed over said dielectric layer for coupling to said first die pads;
• a first protective layer formed over said signal channels to expose the first end of said signal channels;
• conductive elements formed on said first end of said signal channels;
• a second electronic device with second die pads coupled to said conductive elements;
• a second protective layer formed under said second electronic device to expose said second die pads of said second electronic device;
• a second dielectric layer formed under said first electronic device, said support element and said filling material;
• a third protective layer formed under said second dielectric layer;
• a second support element formed around said at least one first electronic device;
• backside signal channels formed under said second dielectric layer for connecting to said second support element;
• solder balls formed under said third protective layer and said backside signal channels for connecting to said backside signal channels;
• and
• a connecting layer formed on said first die pads and said second support element, and under said signal channels.