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US 8,619,428 B2Granted
Electronic package structure
AssigneeCyntec Co., Ltd.
InventorsHan-Hsiang Lee, Yi-Cheng Lin, Pei-Chun Hung, Bau-Ru Lu, Da-Jung Chen, Jeng-Jen Li
Life of this patent
Estimating the term…
Abstract
An electronic package structure is provided. The electronic package structure comprises a substrate, a first electronic element, and a second electronic element. The substrate includes a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate. The first electronic element is disposed on the heat-dissipating plate and coupled to the circuit board. The second electronic element is disposed on the circuit board and coupled to the circuit board.
Claims15
An electronic package structure comprising:
- a substrate including a heat-dissipating plate and a circuit board partially covering the heat-dissipating plate;
- a first electronic element disposed on the heat-dissipating plate and coupled to the circuit board;
- and
- a second electronic element disposed on the circuit board and coupled to the circuit board,
- wherein the substrate further comprises a plurality of conductive nodes,
- the circuit board has a circuit layout and defines an opening extending from the first surface of the circuit board to the second surface of the circuit board opposite the first surface,
- the heat-dissipating plate is disposed on the second surface of the circuit board, and the location of the heat-dissipating plate corresponds to that of the opening so that the heat-dissipating plate covers at least a part of the opening,
- the conductive nodes are disposed on the circuit board, coupled to the circuit layout, and used for being coupled to an external electronic device,
- the first electronic element is disposed in the opening and coupled to the circuit layout, and
- the second electronic element is coupled to the circuit layout, wherein the amount of heat produced by the first electronic element is larger than the amount of heat produced by the second electronic element, and
- wherein the second electronic element is disposed on the first surface of the circuit board, and the conductive nodes are disposed on the second surface of the circuit board, and
- wherein the substrate further includes a plurality of the thermal vias, each thermal via comprising:
- a through-hole extending from the first surface of the circuit board to the second surface of the circuit board;
- and
- a heat-dissipating material being filled in the through-hole, and
- the electronic package structure further comprises a third electronic element disposed on the first surface and coupled to the circuit layout, wherein
- the amount of heat produced by the third electronic element is between the amount of heat produced by the first electronic element and the amount of heat produced by the second electronic element and,
- the location of the third electronic element corresponds to that of the thermal vias so that the heat from the third electronic element is conducted from the first surface to the second surface through the heat-dissipating material.
15 more elements
An electronic package structure comprising:
- a substrate including a heat-dissipating plate and a circuit board partially covering the heat-dissipating plate, wherein the circuit board is a printed circuit board;
- a first electronic element disposed on the heat-dissipating plate and coupled to the circuit board;
- and
- a second electronic element disposed on the circuit board and coupled to the circuit board,
- wherein, the printed circuit board has a circuit layout and a plurality of conductive nodes, and the printed circuit board defines an opening extending from the first surface of the printed circuit board to the second surface of the printed circuit board opposite the first surface,
- the heat-dissipating plate is disposed on the second surface of the printed circuit board, and the location of the heat-dissipating plate corresponds to that of the opening so that the heat-dissipating plate covers at least a part of the opening,
- the conductive nodes are coupled to the circuit layout and adapted for being coupled to an external electronic device,
- the first electronic element is disposed in the opening and coupled to the circuit layout, and
- the second electronic element is coupled to the printed circuit layout, wherein the amount of heat produced by the first electronic element is larger than the amount of heat produced by the second electronic element, and
- wherein the heat-dissipating plate is fitted within the printed circuit board so that the lead-frame heat-dissipating plate does not protrude through the second surface of the printed circuit board.
7 more elements
An electronic package structure of a direct current to direct current converter, the electronic package structure comprising:
- a substrate including:
- a printed circuit board having a circuit layout and a plurality of conductive nodes, wherein
- the conductive nodes are coupled to the circuit layout and adapted for being coupled to an external electronic device, and
- the printed circuit board defines an opening extending from a first surface of the printed circuit board to a second surface of the printed circuit board opposite the first surface;
- and
- a heat-dissipating plate disposed on the second surface and fitted within the printed circuit board so that the heat-dissipating plate does not protrude through the second surface of the printed circuit board, wherein and the location of the heat-dissipating plate corresponds to that of the opening so that the heat-dissipating plate covers at least a part of the opening;
- a first electronic element disposed on the heat-dissipating plate, located in the opening and coupled to the circuit layout of the printed circuit board;
- and
- a second electronic element disposed on the printed circuit board and coupled to the circuit layout of the circuit board, wherein the amount of heat produced by the first electronic element is larger than the amount of heat produced by the second electronic element.
6 more elements
Dependencies are inferred from the claim text.