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US 8,619,420 B2Granted
Consolidated thermal module
AssigneeApple Inc.
InventorsBrett W. Degner, Gregory Tice
Life of this patent
Estimating the term…
Abstract
A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.
Claims16
In a computing device, a low Z profile consolidated thermal module (CTM) for securing and cooling an integrated circuit (IC) mounted to a printed circuit board (PCB), the CTM comprising:
- a heat removal assembly having a reduced footprint, the heat removal assembly disposed on a first surface of the PCB and in thermal contact with the IC;
- a backer plate disposed on a second surface of the PCB;
- a retaining mechanism disposed on the backer plate;
- and
- at least one fastener used to secure the heat removal assembly to the backer plate and the retaining mechanism, wherein the retaining mechanism causes a substantially uniform retaining force to be applied across the backer plate thereby minimizing an amount of torque applied to the IC, wherein the heat removal assembly comprises:
- a thermally conductive casting,
- a heat pipe arranged to transport excess heat away from the IC, and
- a thermally conductive slug disposed between the heat pipe and the IC.
5 more elements
A method of installing a consolidated thermal module (CTM) in a small form factor computer to cool an integrated circuit (IC), comprising:
- receiving a plurality of CTM components including at least a backer plate, a retaining mechanism, and a heat removal assembly;
- receiving a printed circuit board (PCB) for a small form factor computer;
- placing the backer plate on a first side of the PCB;
- placing the retaining mechanism on the backer plate;
- placing the heat removal assembly on a second side of the PCB, in thermal contact with the IC;
- and
- securing the retaining mechanism to the heat removal assembly, wherein the heat removal assembly comprises:
- a thermally conductive casting,
- a heat pipe arranged to transport excess heat away from the IC, and
- a thermally conductive slug disposed between the heat pipe and the IC.
7 more elements
Dependencies are inferred from the claim text.