Solid state imaging device having lens and material with refractive index greater than 1 between the lens and imaging chip
AssigneeSony Corporation
InventorAtsushi Toda
Life of this patent
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Abstract
A solid-state image-taking apparatus which have a solid-state image-taking device includes a chip of the solid-state image-taking device, an imaging lens configured to focus incoming light into an image on the solid-state image-taking device, and a material of a refraction index larger than 1, which is arranged between the chip and the imaging lens.
Claims11
A solid-state image-taking apparatus which includes a solid-state image-taking device, the solid-state image-taking apparatus comprising:
- a chip solid-state image-taking device;
- an imaging lens configured to focus incoming light into an image on the chip solid-state image-taking device;
- and
- a material of a refraction index larger than 1, which is arranged between the chip and the imaging lens and is laminated on an uppermost layer of the chip, and the material of a refraction index larger than 1 has a depth that is larger than or equal to a focal depth of the imaging lens.
A manufacturing method of a solid-state image-taking apparatus including a chip of a solid-state image-taking device and an imaging lens configured to focus incoming light into an image on the solid-state image-taking device, the manufacturing method comprising:
- forming a material of a refraction index larger than 1 between the chip and the imaging lens and being laminated on an uppermost layer of the chip, and the material of a refraction index larger than 1 has a depth that is larger than or equal to a focal depth of the imaging lens.
A camera which includes a solid-state image-taking apparatus including a solid-state image-taking device and is used for taking an image, the camera comprising:
- a chip of the solid-state image-taking device;
- an imaging lens configured to focus incoming light into an image on the solid-state image-taking device;
- and
- a material of a refraction index larger than 1, which is arranged between the chip and the imaging lens and is laminated on an uppermost layer of the chip, and the material of a refraction index larger than 1 has a depth that is larger than or equal to a focal depth of the imaging lens.
Dependencies are inferred from the claim text.