Semiconductor device with wireless communication
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsKoji Dairiki, Konami Izumi
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Abstract
To provide a semiconductor device in which wireless communication is performed between devices formed over different substrates and connection defects of wirings are reduced. A first device having a first antenna is provided over a first substrate, a second device having a second antenna which can communicate with the first antenna is provided over a second substrate, and the first substrate and the second substrate are bonded to each other to manufacture a semiconductor device. The first substrate and the second substrate are bonded to each other by bonding with a bonding layer interposed therebetween, anodic bonding, or surface activated bonding.
Claims14
A semiconductor device comprising:
- a first substrate provided with a first element group connected to a first antenna;
- and
- a second substrate provided with a second element group connected to a second antenna,
- wherein the first element group comprises one selected from the group consisting of a thin film transistor and a field effect transistor,
- wherein the second element group comprises one selected from the group of a transducer and a microactuator,
- wherein the first element group and the second element group communicate with each other wirelessly through the first antenna and the second antenna, and
- wherein the first substrate and the second substrate are bonded to each other.
A semiconductor device comprising:
- a first substrate provided with a first element group connected to a first antenna;
- and
- a second substrate provided with a second element group connected to a second antenna,
- wherein the first element group comprises one selected from the group consisting of a thin film transistor and a field effect transistor,
- wherein the second element group comprises one selected from the group of a transducer and a microactuator,
- wherein the first element group and the second element group communicate with each other wirelessly through the first antenna and the second antenna, and
- wherein the first substrate and the second substrate are bonded to each other with a bonding layer provided between the first substrate and the second substrate.
A semiconductor device comprising:
- a first substrate provided with a first element group connected to a first antenna;
- and
- a second substrate provided with a second element group connected to a second antenna,
- wherein the first element group comprises one selected from the group consisting of a thin film transistor and a field effect transistor,
- wherein the second element group comprises one selected from the group of a transducer and a microactuator,
- wherein the first element group and the second element group communicate with each other wirelessly through the first antenna and the second antenna, and
- wherein the first substrate is bonded to a third substrate and the second substrate is bonded to the third substrate.
Dependencies are inferred from the claim text.