Electronic device case, method and mold for manufacturing the same, and mobile communications terminal
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJae Suk Sung, Sung Eun Cho, Ha Ryong Hong, Dae Kyu Lee, Dae Seong Jeon, Ki Won Chang, Tae Sung Kim, Dae Ki Lim, Hyun Do Park, Nam Il Seo
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