US 8,618,987 B2Granted

Wireless chip

AssigneeSemiconductor Energy Laboratory Co., Ltd.

InventorsShunpei Yamazaki, Konami Izumi

Life of this patent

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Abstract

The invention provides a wireless chip which can secure the safety of consumers while being small in size, favorable in communication property, and inexpensive, and the invention also provides an application thereof. Further, the invention provides a wireless chip which can be recycled after being used for managing the manufacture, circulation, and retail. A wireless chip includes a layer including a semiconductor element, and an antenna. The antenna includes a first conductive layer, a second conductive layer, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer, and has a spherical shape, an ovoid shape, an oval spherical shape like a go stone, an oval spherical shape like a rugby ball, or a disc shape, or has a cylindrical shape or a polygonal prism shape in which an outer edge portion thereof has a curved surface.

Claims15

Dependent claims

A semiconductor device comprising:

an antenna and
a circuit,
wherein the antenna comprises a first conductive layer, a second conductive layer and a third conductive layer;
wherein the first conductive layer comprises a first region, a second region and a third region between the first region and the second region,
wherein the first conductive layer is bent so that a surface of the first region is parallel to a normal direction of the third region, and a surface of the second region is parallel to the normal direction of the third region,
wherein at least a part of the second conductive layer is aligned with the first region of the first conductive layer,
wherein at least a part of the third conductive layer is aligned with the second region of the first conductive layer,
wherein the circuit is provided between the first region and the second region,
wherein the circuit is provided between the second conductive layer and the third conductive layer,
wherein the first conductive layer is not directly in contact with the second conductive layer, and
wherein the first conductive layer is not directly in contact with the third conductive layer.

8 more elements

Dependencies are inferred from the claim text.

Facts

Application: 13/671,845Filed 8 Nov 2012 · continuation
Priority: JP 2005-12932627 Apr 2005
Published: US 2013/0162482 A127 Jun 2013
Granted: 31 Dec 2013
Term ends: Not estimatedThe source records don’t support an estimate.

Classification10 codes

H01Q 1/38
Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith: formed by a conductive layer on an…
G06K 19/04
Record carriers for use with machines and with at least a part designed to carry digital markings: characterised by the shape
G06K 19/07749
Constructional details, e.g. mounting of circuits in the carrier: the record carrier being capable of non-contact communication, e.g.…
G06K 19/07775
Antenna details: the antenna being on-chip

Family

PCT/JP2006/309127Parent of this continuation · filed 25 Apr 2006
Application12/981,574Parent of this continuation · filed 30 Dec 2010
US 7,864,115 B2Parent of this continuation · filed 4 Jan 2011
Application13/371,675Parent of this continuation · filed 13 Feb 2012
US 8,120,538 B2Parent of this continuation · filed 21 Feb 2012
US 2013/0162482 A1Pre-grant publication · published 27 Jun 2013
US 8,310,399 B2Parent of this continuation
Application11/918,627Parent of this continuation
US 2009/0066589 A1Published application
US 2011/0139880 A1Published application
US 2012/0139017 A1Published application
US 8,618,987 B2This patent

From the US filing history. Foreign family members aren’t listed.