Connection structure of electronic component and wired circuit board, wired circuit board assembly, and method for testing electronic component

A method for testing an electronic component comprising the steps of:

• preparing an electronic component including a plurality of external terminals,
• preparing a wired circuit board including a metal supporting board, an insulating base layer formed on the metal supporting board, and a conductive pattern formed on the insulating base layer, the conductive pattern including a plurality of terminal portions for connection with the plurality of external terminals, the terminal portions being arranged in a terminal forming portion and along the width direction that is perpendicular to the longitudinal direction of the metal supporting board with a space provided therebetween, and the metal supporting board being cut out at the terminal forming portion so as to sandwich the plurality of terminal portions in the width direction,
• disposing the electronic component and the wired circuit board so that the plurality of external terminals and the plurality of terminal portions face each other,
• bending the wired circuit board so that the conductive pattern is warped,
• allowing the plurality of terminal portions and the plurality of external terminals to be abutted by the reaction force of the warping, and
• testing electrical characteristics of the electronic component through the wired circuit board.

A method for connecting an electronic component with a wired circuit board,

• wherein the electronic component includes a plurality of external terminals, and
• wherein the wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, and a conductive pattern formed on the insulating base layer, the conductive pattern including a plurality of terminal portions for connection with the plurality of external terminals, the terminal portions being arranged in a terminal forming portion of the wired circuit board and along the width direction that is perpendicular to the longitudinal direction of the metal supporting board with a space provided therebetween, and the metal supporting board being cut out at the terminal forming portion so as to sandwich the plurality of terminal portions in the width direction,
• the method comprising the steps of:
• disposing the electronic component and the wired circuit board such that the plurality of external terminals and the plurality of terminal portions face each other, and
• bending the wired circuit board so that the conductive pattern is warped, and allowing the plurality of terminal portions and the plurality of external terminals to be abutted by reaction force of the warping, thereby electrically connecting the electronic component with the wired circuit board.