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US 8,618,795 B1Granted
Sensor assembly for use in medical position and orientation tracking
AssigneeGeneral Electric Company
InventorsKaustubh Ravindra Nagarkar, William Hullinger Huber, Daniel Eduardo Groszmann
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Abstract
A sensor assembly is provided for use in tracking a medical device. The sensor assembly comprises a magnetoresistance sensor capable of providing position and orientation information. In certain implementations, the magnetoresistance position and orientation sensor is originally configured for connection to a substrate using one type of interconnect approach but is modified to be connected using a different interconnect approach.
Claims19
A position and orientation sensor assembly, comprising:
- a magnetoresistance sensor array comprising a plurality of contact pads, wherein the plurality of contact pads are not configured to be connected by a solder connection;
- a plurality of metallization layers deposited on each of the plurality of contact pads, wherein each plurality of metallization layers comprises at least one solderable layer and an adhesion promoter layer disposed between the at least one solderable layer and a respective contact pad, and wherein the adhesion promoter layer comprises titanium or titanium oxide, and wherein each of the plurality of metallization layers comprises a corrosion resistance layer, wherein the corrosion resistance layer is or includes gold, and a diffusion barrier layer disposed between the at least one solderable layer and the corrosion resistance layer, and wherein the solderable layer is disposed between the adhesion promoter layer and the diffusion barrier layer;
- a printed circuit substrate comprising a plurality of contacts corresponding to the plurality of contact pads;
- and
- a solder material connection formed between each respective solderable layer and a corresponding contact of the plurality of contacts.
2 more elements
A method of fabricating a magnetoresistance sensor assembly, comprising:
- applying an adhesion promoter layer over a contact pad of a magnetoresistance sensor die, wherein the contact pad is not suitable for receiving a soldered connection;
- applying a solderable layer over the adhesion promoter layer, wherein the adhesion promoter layer comprises titanium or titanium oxide;
- applying a diffusion barrier layer over the solderable layer;
- applying a corrosion resistance layer, wherein the corrosion resistance layer is or includes gold, over the diffusion barrier layer,
- disposing solder material over the diffusion barrier layer;
- and
- reflowing the solder material to electronically connect the contact pad of the magnetoresistance sensor die with a corresponding contact of a printed circuit substrate.
4 more elements
Dependencies are inferred from the claim text.