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US 8,618,742 B2Granted
Illumination source and manufacturing methods
AssigneeSoraa, Inc.
InventorsFrank Tin Chung Shum, Clifford Jue
Life of this patent
Estimating the term…
Abstract
A light source manufacturing method includes disposing LEDs upon a substrate having input pads for receiving an operating voltage for the LEDs, bonding a flexible PC board to the substrate, and using a thermally conductive adhesive bonding the substrate onto a planar region of a heat sink.
Claims19
A method for forming a light source comprising:
- disposing light emitting diodes (LEDs) on an insulated substrate having input pads for receiving an operating voltage for the LEDs;
- bonding a flexible printed circuit to the insulated substrate, the flexible printed circuit including input contacts to receive the operating voltage and output pads to provide the operating voltage to the insulated substrate;
- bonding the insulated substrate onto a planar region of a heat sink using a thermally conductive adhesive;
- forming a driving module having a plurality of electronic circuits on a printed circuit board, the driving module including input contacts configured to receive a driving voltage from an external voltage source and a plurality of output contacts configured to output the operating voltage;
- disposing the driving module within a casing having a base, the plurality of input contacts and the plurality of output contacts extending beyond an interior of the casing;
- inserting the casing within an interior channel of the heat sink;
- electrically bonding the plurality of output contacts of the driving module to the plurality of input contacts of the flexible printed circuit;
- inserting the base in a compatible base socket;
- applying the driving voltage from the external voltage source;
- determining a light output brightness for the light source, and when the light output brightness exceeds a desired light output brightness;
- and
- packaging the light source in a protective container.
9 more elements
A light source comprising:
- light emitting diodes (LEDs) disposed upon an insulated substrate having input pads coupled to receive an operating voltage for the LEDs;
- a flexible printed circuit bonded to the insulated substrate, the flexible printed circuit including a plurality of input contacts configured to receive the operating voltage for the LEDs and a plurality of output pads to provide the operating voltage to the insulated substrate;
- an heat sink including a planar region having the insulated substrate affixed thereto with a thermally conductive epoxy;
- a driving module having electronic circuits disposed on a printed circuit board, input contacts configured to receive the a driving voltage from an external voltage source, and a output contacts configured to output the operating voltage;
- a casing having a base, wherein the driving module is disposed within the casing, the input contacts and the output contacts extending beyond an interior of the casing;
- wherein the casing is disposed within an interior channel of the heat sink;
- and wherein the output contacts of the driving module are bonded to the input contacts to provide the light source;
- a base socket, wherein the base is disposed in the base socket;
- an external voltage source configured to provide a driving voltage;
- and
- a protective container, wherein the light source exceeds a desired light output brightness.
8 more elements
Dependencies are inferred from the claim text.