Method of manufacturing the piezoelectric device and the same
AssigneeNihon Dempa Kogyo Co., Ltd.
InventorsRyoichi Ichikawa, Yoshiaki Amano, Kenji Kamezawa
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AssigneeNihon Dempa Kogyo Co., Ltd.
InventorsRyoichi Ichikawa, Yoshiaki Amano, Kenji Kamezawa
Estimating the term…
To provide a piezoelectric device prevented from overflowing of sealing materials. The piezoelectric device (100) stores a piezoelectric vibrating piece (30) having a pair of excitation electrodes. The piezoelectric device comprises: a package lid (10), including a first bonding surface (M1) formed in periphery of the package lid in a circumferential pattern and a lid recess (10); a package base (30), including a second bonding surface (M2), a base recess surrounded by a second bonding surface that is higher than the second bonding surface, and a pair of seats that is protruding from the base recess, situated for mounting the piezoelectric piece; a piezoelectric piece mounted onto the pair of seats; and a non electric conductive sealing material (48) disposed peripherally in relative to the first bonding surface and the second bonding surface in a circumferential pattern, thus the adhesive bonding the first bonding surface and the second bonding surface. Furthermore, height of the second bonding surface and the pair of seats are same height.
A piezoelectric device for storing a piezoelectric piece having a pair of excitation electrodes, the piezoelectric device comprising:
Dependencies are inferred from the claim text.