Back to results
US 8,618,676 B2Granted
Method of assembly of a semiconductor package for the improvement of the electrical testing yield on the packages so obtained
AssigneeSTMicroelectronics (Malta) Ltd
InventorsRobert Caruana, Adrian-Michael Borg, Joseph Gauci
Life of this patent
Estimating the term…
Abstract
A method of assembly of a semiconductor package includes treating the electrical contacts thereof by the application on the electrical contacts of a chemical composition comprising at least one ionic polar surfactant. A semiconductor package has a coating on the electrical contacts thereof, the coating comprising at least one ionic polar surfactant. A device includes a semiconductor package with electrical contacts on a circuit board, the electrical contacts having a coating that includes an ionic surfactant.
Claims22
A semiconductor package, comprising:
- electrical contacts each coated with a coating, said coating including an ionic surfactant, the ionic surfactant having:
- a non-polar hydrophobic group;
- and
- an inorganic hydrophilic group.
1 more element
A method, comprising:
- assembling a semiconductor package that includes electrical contacts;
- and
- coating each of the electrical contacts with a chemical composition that includes an ionic surfactant, the ionic surfactant having:
- a non-polar hydrophobic group;
- and
- an inorganic hydrophilic group.
3 more elements
Dependencies are inferred from the claim text.