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US 8,618,675 B2Granted
Thin semiconductor die package
AssigneeContinental Automotive Systems, Inc.
InventorsXiaoyi Ding, Jeffrey James Frye
Life of this patent
Estimating the term…
Abstract
A semiconductor die is attached to a substrate by a glass frit layer. Gas that might be trapped between the die and the glass frit layer during firing of the glass frit can escape through passages that are formed against the bottom surface of the die by topographies that extend away from and which are substantially orthogonal to the bottom of the die.
Claims18
A semiconductor apparatus comprising:
- a semiconductor die formed from a semiconductor material, the semiconductor die comprising first and second opposing sides, each side having a corresponding area, the first side of the semiconductor die formed to provide a plurality of topographies formed from the semiconductor material comprising the die and extending from the first side of the die, each topography having a height and a cross sectional shape and a top surface area, the plurality of topographies being distributed across the first side of the die and spaced apart from each other to define spaces between them, the top surface area of each topography occupying a corresponding fractional portion of the planar area of the first side, the sum of the top surface areas of the topographies being less than about fifty percent of the planar area of the first side, spaces between the evenly distributed topographies extending across the first area and providing a gas passage along the first side of the die.
A semiconductor apparatus comprised of:
- a thin semiconductor die comprised of semiconductor material, first and second sides, and a plurality of posts formed from the semiconductor material, extending from the first side and being substantially evenly distributed across the first side of the die, the top surface area of each post occupying a fractional portion of the planar area of the first side, the sum of the top surface areas of the posts occupying less than about fifty percent of the planar area of the first side, spaces between the evenly distributed topographies extending across the first area, the second side of the die being comprised of at least one piezo-resistive bridge embedded therein;
- a layer of glass having first and second sides, the first side bonded against the first side of the die and bonded to the posts such that the posts are embedded into the glass;
- and
- a substrate layer bonded to the second side of the layer of glass.
1 more element
Dependencies are inferred from the claim text.