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US 8,618,674 B2Granted
Semiconductor device including a sintered insulation material
AssigneeInfineon Technologies AG
InventorsIvan Nikitin, Joachim Mahler
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Abstract
A semiconductor device includes a carrier and a first chip attached to the carrier. The semiconductor device includes a sintered insulation material over at least a portion of the carrier and the first chip.
Claims24
A semiconductor device comprising:
- a leadframe;
- a first chip attached to the leadframe;
- and
- a sintered insulation material over at least a portion of the leadframe and the first chip,
- wherein the sintered insulation material defines at least one opening, the at least one opening including a first portion having a first cross-sectional width and a second portion having a second cross-sectional width less than the first cross-sectional width, the first portion between the second portion and the leadframe, and the first portion and the second portion spaced apart from the first chip, and
- wherein a conducting element is formed in the first portion and the second portion of the at least one opening or the at least one opening is for adhesion to a mold compound.
3 more elements
A semiconductor device comprising:
- a carrier;
- a first chip and a second chip attached to the carrier by an attachment material;
- a sintered insulation material over at least a portion of the carrier, at least a portion of the first chip, and at least a portion of the second chip;
- a first metal line over the sintered insulation material and electrically coupling the first chip to the second chip;
- and
- a second metal line electrically coupling the second chip to the carrier,
- wherein the sintered insulation material comprises one of a sintered phenol resin, a sintered amino resin, a sintered siloxane, a sintered unsaturated polyester, a sintered polybenzoxazole, a sintered polybenzimidazole, a sintered epoxide, and a sintered ceramic, and
- wherein the sintered insulation material defines at least one opening, the at least one opening including a first portion having a first cross-sectional width and a second portion having a second cross-sectional width less than the first cross-sectional width, the first portion between the second portion and the carrier, and the first portion and the second portion spaced apart from the first chip and the second chip.
5 more elements
A semiconductor device comprising:
- a carrier;
- a chip having a first side and a second side opposite the first side, the chip attached to the carrier with the first side of the chip facing the carrier;
- a sintered insulation material over at least a portion of the carrier and the second side of the chip;
- and
- as first conducting element directly contacting the second side of the chip, and the sintered insulation material,
- wherein the sintered insulation material defines at least one opening, the at least one opening including a first portion having a first cross-sectional width and a second portion having a second cross-sectional width less than the first cross-sectional width, the first portion between the second portion and the carrier, and the first portion and the second portion spaced apart from the chip, and
- wherein a second conducting element is formed in the first portion and the second portion of the at least one opening or the at least one opening is for adhesion to a mold compound.
4 more elements
A semiconductor device comprising:
- a leadframe,
- a first chip having a first side and a second side opposite the first side, the first chip attached to the leadframe with the first side of the first chip facing the leadframe;
- a second chip having a first side and a second side opposite the first side, the second chip attached to the leadframe with the first side of the second chip facing the leadframe;
- a sintered insulation material over at least a portion of the leadframe, at least a portion of the second side of the first chip, and at least a portion of the second side of the second chip;
- a first metal line directly contacting the sintered insulation material, the second side of the first chip, and the second side of the second chip;
- and
- a second metal line directly contacting the sintered insulation material, the second side of the second chip, and the leadframe,
- wherein the sintered insulation material comprises one of a sintered phenol resin, a sintered amino resin, a sintered siloxane, a sintered unsaturated polyester, a sintered polybenzoxazole, a sintered polybenzimidazole, a sintered epoxide, and a sintered ceramic, and
- wherein the sintered insulation material defines at least one opening, the at least one opening including a first portion having a first cross-sectional width and a second portion having a second cross-sectional width less than the first cross-sectional width, the first portion between the second portion and the leadframe, and the first portion and the second portion spaced apart from the first chip and the second chip.
6 more elements
Dependencies are inferred from the claim text.