Package structures
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsBenson Liu, Hsien-Wei Chen, Shin-Puu Jeng, Hao-Yi Tsai
Life of this patent
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Abstract
A package structure includes a substrate, a first die and at least one second die. The substrate includes a first pair of parallel edges and a second pair of parallel edges. The first die is mounted over the substrate. The first die includes a third pair of parallel edges and a fourth pair of parallel edges, wherein the third pair of parallel edges and the fourth pair of parallel edges are not parallel to the first pair of parallel edges and the second pair of parallel edges, respectively. The at least one second die is mounted over the first die.
Claims20
A package structure, comprising:
- a substrate comprising a first pair of parallel edges and a second pair of parallel edges;
- a first die mounted over the substrate, the first die comprising a third pair of parallel edges and a fourth pair of parallel edges, wherein the third pair of parallel edges and the fourth pair of parallel edges are not parallel to the first pair of parallel edges and the second pair of parallel edges, respectively;
- and
- at least one second die mounted over the first die, wherein the second die comprises a fifth pair of parallel edges and a sixth pair of parallel edges, and the fifth pair of parallel edges and the sixth pair of parallel edges are not parallel to the first pair of parallel edges and the second pair of parallel edges, respectively.
A package structure, comprising:
- a substrate comprising a first pair of parallel edges and a second pair of parallel edges;
- a first die mounted over the substrate;
- and
- at least one second die mounted over the first die so that the first die underlies an entire area occupied by the second die, wherein the second die comprises a third pair of parallel edges and a fourth pair of parallel edges, and the third pair of parallel edges and the fourth pair of parallel edges are not parallel to the first pair of parallel edges and the second pair of parallel edges, respectively.
A method comprising:
- mounting a first die over a substrate comprising a first pair of parallel edges and a second pair of parallel edges, the first die comprising a third pair of parallel edges and a fourth pair of parallel edges, so that the third pair of parallel edges and the fourth pair of parallel edges are not parallel to the first pair of parallel edges and the second pair of parallel edges, respectively;
- and
- mounting at least one second die over the first die, the second die comprising a fifth pair of parallel edges and a sixth pair of parallel edges, so that the fifth pair of parallel edges and the sixth pair of parallel edges are not parallel to the first pair of parallel edges and the second pair of parallel edges, respectively.
Dependencies are inferred from the claim text.