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US 8,618,672 B2Granted
Three dimensional stacked chip package structure
AssigneeIndustrial Technology Research Institute
InventorsYu-Wei Huang, Tsung-Fu Yang
Life of this patent
Estimating the term…
Abstract
This disclosure related to a stacked chip package structure having a sloped dam structure located on the substrate and beside the chip stack. The dam structure can facilitate the dispensing process of the underfill.
Claims12
A stacked chip package structure, comprising:
- at least a chip stack disposed on a substrate, wherein the chip stack includes at least two chips piled up over the substrate in a first direction;
- a dam structure disposed on the substrate, wherein the dam structure leans against at least one side of the chip stack, the dam structure has at least one slanted surface extending aslant along the at least one side of the chip stack and from a middle or higher of the chip stack to the substrate;
- and
- an underfill filled between the chips of the chip stack.
1 more element
Dependencies are inferred from the claim text.