Integrated circuit package system with wafer scale heat slug

An integrated circuit package system comprising:

• providing an integrated circuit die;
• forming a layered structure blank wherein the layered structure blank is a stack of an adhesive layer blank, an electrical insulator layer blank, and a heat slug blank;
• dicing the layered structure blank into a singulated, layered structure equivalent in size to the integrated circuit die, the singulated, the layered structure having an electrical insulator layer between and in direct contact with a heat slug and an adhesive layer, the adhesive layer attached directly on the integrated circuit die;
• attaching a base and the singulated, layered structure to the integrated circuit die;
• partially encapsulating a molding compound around the integrated circuit die and the heat slug;
• attaching bond wires to a top of the base for an electrical connection between the integrated circuit die and the base, the bond wires in direct contact with and extending through the adhesive layer and the molding compound, and the bond wires protected from the heat slug by the electrical insulator layer;
• and
• attaching solder balls to a bottom of the base.

An integrated circuit package system comprising:

• an integrated circuit die;
• a base having the integrated circuit die mounted thereon;
• a singulated, layered structure, attached to the integrated circuit die, including an electrical insulator layer between and in direct contact with a heat slug and an adhesive layer, the adhesive layer attached directly on the integrated circuit die;
• a molding compound partially encapsulating the integrated circuit die and the heat slug;
• and
• bond wires for an electrical connection between the integrated circuit die and a top of the base, the bond wires in direct contact with and extending through the adhesive layer and the molding compound.